2uul BH09 THE ONE JIG (Indian Version) for Mobile Phone Motherboard IC Repair

2UUL BH09 THE ONE JIG (Indian Version) for Mobile Phone Motherboard IC Repair

✅ Key Features

• Rotary locking design firmly holds the motherboard or IC without rebound during repair work.
• Special anti-slip pads help prevent movement and provide better stability.
• Built-in bottom heat sink improves hot air circulation and heat dissipation.
• Adjustable high, middle, and low positions support different PCB sizes and thicknesses.
• Special IC beam clamp design helps avoid chip damage while removing black glue.
• Provides protection for upper and lower layers of double-layer motherboards during maintenance.
• Compatible with mobile phone motherboards of various shapes and sizes.

🔧 Suitable For

• Mobile phone motherboard repair
• CPU and NAND cleaning
• IC tin removal and rework
• BGA soldering applications
• Micro-soldering and chip-level repair
• Double-layer PCB maintenance

📌 Version Information

This is the Indian Version of the 2UUL THE ONE JIG series. Its core functionality is similar to the BH08 Arabic Version, with differences mainly related to version and packaging. Both models are designed for professional motherboard and IC repair applications.

📦 Package Includes

• 1 × 2UUL BH09 THE ONE JIG (Indian Version)