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BGA Stencils
Shop high-quality BGA stencils for mobile IC repair at UToolsZone. Perfect for precise solder ball placement, IC reballing, and motherboard-level repair work for professional technicians.
2UUL BH17 CPU REBALL BASE Magnetic Dual-Sided Reballing Platform Set
2UUL BH17 CPU Reball Base Magnetic Dual Sided BGA Reballing Platform Set for iPhone / Android Key Specifications & Components Model: BH17 (Cpureball Base). Structure: CNC-machined aluminum alloy body with a dual-sided magnetic frame for maximum stability. Included Stencils: Typically comes with 75 precision CPU stencils covering a wide range of chipsets. Stencil Thickness: Includes options for 0.12mm (some kits specify T0.6 for Apple and T0.35 for Android) to handle various reballing requirements. Dimensions: Platform size is approximately 58 Γ 58 Γ 11 mm with a net weight of 238g. Features and Benefits Magnetic Locking: Features a powerful dual-sided magnetic system that holds both the CPU and the stencil firmly in place, preventing shifting during heating. High Compatibility: Supports a broad spectrum of mobile processors, including Apple A-series (A10 to A19), ..



