2UUL BH02 Mini Jig for Phone Board & Chip The 2UUL BH02 Mini Jig is a compact multifunction fixture designed for securing phone motherboards and IC chips during repair, soldering, and rework operations. 🔧 Professional Repair Tool Designed for technicians who require stable positioning while performing motherboard repairs, IC replacement, and precision soldering tasks. 📱 Wide Compatibility Suitable for mobile phone motherboards, IC chips, and various small electronic components used in repair applications. ♨️ Heat-Resistant Support Provides stable clamping and helps reduce the risk of motherboard deformation caused by heating during soldering operations. 🛠 Multifunctional Fixing Design The adjustable fixture securely holds components in place, improving precision and making repair work more efficient. 🎒 Compact & Portable Small size and lightweight design make it convenient for professional repair shops and portable tool kits. 📦 Package Includes 1 × 2UUL BH02 Mini Jig Fixture

2uul the One Jig BH03 Fixture Introducing 2UUL The one jig fixture the ultimate mobile repair JIG fixture! Purpose-built for mobile repairing, this compact tool streamlines intricate repairs with precision and ease. Trust 2UUL for efficient repairs anytime, anywhere. Your go-to solution for mobile technicians!   1. To allow heating, a special anti-skid pad prevents clamps from moving during use.  Let the hot air can be discharged more efficiently. Add a heat sink to the bottom of the clamp. 2. Rotary shaft locks the motherboard or IC more efficiently, Fixed well without a rebound. 3. Fixtures also support IC-type fixtures fixed for the removal of back glue, the clamp is designed  to bear the force of the IC beam, which can hold up the empty parts of the IC well and avoid the  IC breaks when removing black glue. 4. The fixture can be adjusted at different distances from the high, middle, and low levels. It's  necessary to loosen the two screws at the bottom, move the fixing plate to the appropriate gear  position, and then tighten the bottom screws to lock it. 5. Protect the upper and lower layers of the double-layer motherboard during maintenance. 6. Suitable for mobile phone motherboards of various sizes and shapes. 7. Suitable for fixing when cleaning large chips such as CPU and NAND  

2UUL BH04 Micro Jig IC Mini Glass Fixture for Mobile Phone Motherboard Repair Key Features and Specifications Material: Built with a tempered insulated glass work surface that offers excellent heat resistance up to 500°C. The surface is easy to clean and resistant to welding oil and rosin residue. Secure Clamping: Features a rotary locking mechanism and a force-bearing IC beam clamp that firmly holds motherboards and chips without movement or rebound, helping prevent damage during repair operations. Adjustable Design: Supports high, middle, and low positions. The fixture can be adjusted by loosening the bottom screws to accommodate PCBs and chips of different sizes and thicknesses. Heat Dissipation: Designed with a bottom heat sink structure and anti-slip pads, allowing hot air to dissipate efficiently while protecting components during soldering and rework. Multi-Function Applications: Mobile phone motherboard repair CPU and NAND chip fixing for cleaning and tin removal IC soldering and micro-soldering work BGA rework and chip maintenance Protection of double-layer motherboards during separation and reassembly Package Includes 1 × 2UUL BH04 Micro Jig IC Mini Glass Fixture

2UUL BH08 The One Jig Motherboard IC Fixture (Arabic Version) Key Features and Specifications Precision Fixture Design: Designed to securely hold mobile phone motherboards and chips during soldering, rework, and maintenance operations. Stable Locking Mechanism: Provides firm clamping to minimize movement during precision repair, helping improve accuracy and protect delicate components. Adjustable Structure: Compatible with different PCB sizes and thicknesses, making it suitable for a wide range of smartphone motherboards. Heat-Resistant Construction: Built for use in high-temperature repair environments and suitable for hot air and micro-soldering applications. Wide Applications: Mobile phone motherboard repair CPU and NAND chip maintenance IC soldering and BGA rework Chip cleaning and tin removal Micro-soldering operations Package Includes 1 × 2UUL BH08 THE ONE JIG (Arabic Version)

2UUL BH09 THE ONE JIG (Indian Version) for Mobile Phone Motherboard IC Repair ✅ Key Features Rotary locking design firmly holds the motherboard or IC without rebound during repair work. Special anti-slip pads help prevent movement and provide better stability. Built-in bottom heat sink improves hot air circulation and heat dissipation. Adjustable high, middle, and low positions support different PCB sizes and thicknesses. Special IC beam clamp design helps avoid chip damage while removing black glue. Provides protection for upper and lower layers of double-layer motherboards during maintenance. Compatible with mobile phone motherboards of various shapes and sizes. 🔧 Suitable For Mobile phone motherboard repair CPU and NAND cleaning IC tin removal and rework BGA soldering applications Micro-soldering and chip-level repair Double-layer PCB maintenance 📌 Version Information This is the Indian Version of the 2UUL THE ONE JIG series. Its core functionality is similar to the BH08 Arabic Version, with differences mainly related to version and packaging. Both models are designed for professional motherboard and IC repair applications. 📦 Package Includes 1 × 2UUL BH09 THE ONE JIG (Indian Version)

2UUL BH11 Universal Phone Board Mid Frame Reballing Magnetic Platform ✅ Main Features Strong built-in magnetic adsorption automatically holds the motherboard and stencil firmly in position. Designed for middle-layer reballing, BGA rework, CPU, IC and chip tin planting applications. Two platform groove depths (1mm and 2mm) support different motherboard and chip thicknesses. High-temperature resistant construction allows direct hot air gun operation during repair. Ensures precise alignment between stencil and pad for more uniform solder balls. Helps prevent stencil bulging and improves stencil service life. Compatible with both iPhone and Android motherboard repair applications. 🔧 Suitable Applications Phone motherboard middle layer reballing CPU and IC chip tin planting BGA rework and soldering Micro-soldering repair work PCB positioning and fixing iPhone and Android board maintenance 📋 Specifications Brand: 2UUL Model: BH11 Type: Universal Magnetic Reballing Platform Groove Depth: 1mm & 2mm Heat Resistance: Yes Compatibility: Universal 📦 Package Includes 1 × 2UUL BH11 Universal Magnetic Platform 2 × Tin Scrapers / Blades Video Download Link: https://vimeo.com/2uul/download/766033574/719b724080

Description: Universal clip fixture. Rotatable top to adjust the height of holder. Fit most mobile phones and tablets. Used to clamp your repaired device. Help the replaced new screen in its right place,not bulge or sink. Make the screen to joint with the frame perfectly. Inside rubber pad will not hurt screen. Please spin the top gently or you maybe break the display screen. There are scratches on the surface,it does not affect function.Please make sure you do not care,thanks. Specification: Material: Metal,rubber Size: 68 x 25 mm Net Weight/pc : 42 g   What's in the Package: 4 x Clip clamp   Holder height: 0~ 15mm (max) Color: Black-Silver Qty: 4 pcs     What's in the Package: 4 x Clip clamp   Specification: Material: Metal,rubber Size: 68 x 25 mm Net Weight/pc : 42 g Holder height: 0~ 15mm (max) Color: Black-Silver Qty: 4 pcs