C-Mount Adjustable Zoom Microscope Lens 130X / 150X / 180X Magnification Options Choose the suitable C-mount zoom lens for your compatible HDMI, USB or VGA video microscope camera. The available variants offer different working distances, zoom ratios and fields of view. 1X–130X Zoom C-Mount Lens Working Distance: 40–170 mm Proportional Zoom Ratio: 1:17 Electrical Magnification: 0.1–1.3X (approximately 1–130X on display) Field of View at Maximum Magnification: 8 × 4.5 mm Field of View at Minimum Magnification: 40 × 33 mm Dimensions: 115 mm length × 40 mm diameter Weight: 210 g 1X–150X Zoom C-Mount Lens Working Distance: 50–1000 mm Relative Zoom Ratio: 1:15 Electrical Magnification: 0.15–2X (approximately 1–150X on display) Field of View at Maximum Magnification: 4.2 × 2.4 mm Field of View at Minimum Magnification: 130 × 70 mm Dimensions: 99 mm length × 30 mm diameter Weight: 195 g 1X–180X Zoom C-Mount Lens Working Distance: 100–150 mm Zoom Ratio: 1:6.5 Electrical Magnification: 0.7–4.5X (approximately 1–180X on display) Field of View at Maximum Magnification: 2.8 × 1.5 mm Field of View at Minimum Magnification: 25 × 14 mm Eyepiece Lens: 0.5X Dimensions: 168 mm length × 50 mm diameter Weight: 570 g Compatibility Note Please check your microscope camera's C-mount compatibility and confirm the required magnification variant before ordering. Actual on-screen magnification depends on the camera sensor, display and system configuration. Packing List 1 × C-Mount Zoom Lens Want to Order This Lens? Contact us on WhatsApp to confirm the variant, price and availability. Order on WhatsApp..

High-Concerned Chemical-Free Made without any high-concerned chemicals, these tweezers are safe to use in various environments, including sensitive electronic repairs. Lightweight and Portable Despite their robust construction, these tweezers are lightweight and portable, making them easy to carry to any repair site. Titanium Steel Material Crafted from high-quality titanium steel, these tweezers offer durability and resistance to corrosion, ideal for professional use. Precision Design The precision design of these tweezers allows for accurate manipulation of small components, enhancing efficiency in repairs. Anti-static Feature These precision tweezers are designed with an anti-static feature, ensuring safe handling of electronic components without causing damage.   Features: Made of high quality titanium alloy, strong and tensile, great corrosive and magnet resistance, long service life. Hard, sharp and precise, picks up 0.02mm fly lines. Specification: Type: Straight/Bend Material: Titanium Alloy Length: approx. 14 cm/5.51 in Edge: 0.15 mm Net Weight: approx. 14 g..

Black 8mm Soft Sponge Mat for Mobile Display Laminating is designed for mobile phone screen lamination and display refurbishment. Its soft, cushioned surface helps support the display during the laminating process and reduces direct pressure on the screen. Key Features Soft Sponge Material: Provides cushioning for mobile displays during lamination. 8mm Thickness: Offers a soft supporting layer for screen refurbishment work. Flexible and Reusable: Designed for repeated use during compatible display repair tasks. Black Colour: Suitable for use with compatible OCA display laminating setups. Specifications Product Type: Display Laminating Sponge Mat Colour: Black Thickness: 8mm Application: Mobile Display Laminating and Screen Refurbishment Package Contents 1 × Black 8mm Soft Sponge Mat Note: Check the mat dimensions and compatibility with your display laminating setup before ordering.  ..

B&R X4301 43-in-1 BGA Maintenance Knife Set is designed for precision chip-level mobile phone repair. It helps technicians remove glue around CPU, NAND and BGA IC chips during disassembly, rework and motherboard servicing. The set includes a titanium alloy handle and 43 interchangeable blades in different shapes for detailed scraping and glue removal. It is suitable for technicians working on iPhone motherboards and other compatible mobile phone repair tasks. Key Features 43 interchangeable blades for different chip repair tasks. Titanium alloy handle for controlled manual handling. Designed for CPU, NAND and BGA IC glue removal. Suitable for motherboard maintenance and chip-level rework. Supplied in a storage case to keep the blades organized. Specifications Brand: B&R Model: X4301 Tool Type: BGA maintenance knife set Handle Material: Titanium alloy Set Contents: 1 handle and 43 blades Package: Storage case Size: 185 × 100 mm (listed package/set size) Applications iPhone CPU and NAND chip glue removal BGA IC disassembly and rework Mobile phone motherboard repair Precision adhesive scraping around chips Note: The blades are sharp precision tools. Work carefully under magnification to avoid damaging PCB tracks or nearby components...

B&R FX-9 Jumper Wire 0.01mm The B&R FX-9 ultra-fine jumper wire is designed for precision micro-soldering and mobile motherboard repair. It can be used for fine circuit connections and PCB track repairs where careful handling is required. Available Options Gold Insulated: Insulated wire for fine jumper connections. Silver Uninsulated: Uninsulated wire for repair applications that require exposed conductive wire. Applications Mobile phone motherboard and PCB repair Broken track and circuit connection repair Fine jumper wiring during micro-soldering Chip-level electronics repair Specifications Brand: B&R Model: FX-9 Listed Diameter: 0.01mm Wire Types: Gold Insulated and Silver Uninsulated Note: Select the required wire type before ordering. Handle carefully under magnification. Check the actual packaging to confirm the diameter and variant supplied.  ..

iPhone 15 Pro Max NFC & Wireless Charging Coil with Flashlight Flex Cable This replacement flex assembly is designed for the iPhone 15 Pro Max. It combines the NFC antenna, wireless charging coil and rear flashlight flex connection in one assembly, making it suitable for repairs when the corresponding functions stop working due to a damaged component. Repair Applications Replacement of a damaged wireless charging coil NFC function-related repairs Rear flashlight flex cable replacement Repair of the combined NFC and wireless charging assembly Product Specifications Compatible Device: Apple iPhone 15 Pro Max Part Type: NFC and wireless charging coil with flashlight flex Assembly: Combined flex cable component Installation: Professional installation recommended Compatibility Note: This part is intended for the iPhone 15 Pro Max only. It is not interchangeable with the standard iPhone 15, iPhone 15 Plus or iPhone 15 Pro. Confirm the device model and connector layout before ordering...

AMAOE Universal BGA Reballing Stencil The AMAOE Universal BGA Reballing Stencil is a multi-function stencil designed for mobile phone motherboard repair. It supports multiple solder ball pitches, making it useful for technicians working with compatible BGA chips during chip-level repairs. Key Features. Supports 0.3 mm, 0.35 mm, 0.4 mm and 0.5 mm solder ball pitches Includes parallel-hole and 45-degree hole patterns Suitable for compatible CPU, eMMC, UFS and power IC reballing Square-hole design for solder ball placement Reusable stainless steel construction Specifications: Brand AMAOE, multi-function universal stencil, 0.12 mm thickness. Note: Choose the correct hole pattern and solder ball size for the IC package before reballing...

The AMAOE Samsung Galaxy Note10 Middle Layer BGA Stencil is designed for motherboard repair and BGA rework on compatible Samsung Galaxy Note10 models. It is intended for use when the middle-layer BGA layout matches the stencil pattern. Key Features Brand: AMAOE Product Type: Middle Layer BGA Stencil Compatible Model Numbers: SM-N970U and N9700 Device Series: Samsung Galaxy Note10 Application: BGA rework and mobile motherboard repair The stencil helps technicians align solder balls or solder paste with the corresponding BGA pad layout during motherboard-level repair. Compatibility Note: Confirm the motherboard model and BGA pattern before use to ensure the stencil matches the device...

The AMAOE SAM22 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and chip-level motherboard repair on compatible Samsung Galaxy A17 devices. It is listed for selected processor layouts, including MT6789V, SM6475 and MT6769V. Key Features Brand: AMAOE Model: SAM22 Thickness: 0.12mm Type: CPU BGA reballing stencil Listed Processor Codes: MT6789V, SM6475 and MT6769V Compatible Device: Samsung Galaxy A17, subject to processor and board layout Application: CPU reballing and mobile motherboard repair The stencil helps technicians align solder balls or solder paste with the matching BGA contact pattern during chip rework. Compatibility Note: Processor codes can correspond to different device platforms. Confirm the actual chipset marking and stencil layout against the motherboard before use...

The AMAOE SAM21 CPU BGA Reballing Stencil is designed for CPU reballing and chip-level motherboard repair on compatible Samsung Galaxy S25 series devices. It is listed for the Qualcomm Snapdragon 8 Elite (SM8750) processor platform. Key Features Brand: AMAOE Model: SAM21 Type: CPU BGA reballing stencil Supported Processor: Qualcomm Snapdragon 8 Elite (SM8750) Compatible Devices: Samsung Galaxy S25 and Galaxy S25+ Application: CPU reballing and smartphone motherboard repair The stencil helps technicians align solder balls or solder paste with the matching CPU BGA contact pattern during chip rework. Compatibility Note: Confirm the installed processor and BGA layout before use. Compatibility may vary by device variant and motherboard revision...

The AMAOE SAM20 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard-level repair on compatible Samsung Galaxy devices. It is listed for the MediaTek MT6835V processor platform. Key Features Brand: AMAOE Model: SAM20 Thickness: 0.12mm Type: CPU BGA reballing stencil Supported Processor: MediaTek MT6835V Listed Model References: SM-A156U and SM-A156E Application: CPU reballing and smartphone motherboard repair The stencil helps technicians align solder balls or solder paste with the matching BGA contact pattern during CPU rework. Compatibility Note: Verify the processor marking and BGA layout on the actual motherboard before use, as regional variants may differ...

The AMAOE SAM18 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard-level repair on compatible Samsung Galaxy devices. It is listed for the Samsung Exynos 1330 (E8535P) and Exynos 1380 (E8835P) processor platforms. Key Features Brand: AMAOE Model: SAM18 Thickness: 0.12mm Type: CPU BGA reballing stencil Supported Processors: Exynos 1330 (E8535P) and Exynos 1380 (E8835P) Compatible Devices: Samsung Galaxy A14 and Galaxy A54, subject to processor variant Application: CPU reballing and smartphone motherboard repair The stencil helps technicians align solder balls or solder paste with the matching BGA contact pattern during CPU rework. Compatibility Note: Check the installed processor and BGA layout before use. Compatibility may vary by regional model and motherboard revision...

The AMAOE SAM16 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and mobile motherboard repair involving compatible Samsung Exynos 1280 processor layouts. It is intended for technicians carrying out chip-level servicing and BGA rework. Key Features Brand: AMAOE Model: SAM16 Thickness: 0.12mm Type: CPU BGA reballing stencil Supported Processor: Samsung Exynos 1280 / E8825 Application: CPU reballing and smartphone motherboard repair The stencil helps align solder balls or solder paste with the matching BGA pattern during CPU reballing. Check the processor marking and stencil layout before starting the repair. Compatibility Note: Confirm the exact processor and motherboard layout before use, as compatibility may vary by device model and revision...

The AMAOE S916U-012 Middle Layer BGA Reballing Stencil is designed for motherboard middle-layer repair on compatible Samsung Galaxy S23+ devices. It helps technicians align solder balls with the board's middle-layer layout during reballing and motherboard rework. Key Features Designed for middle-layer BGA reballing and motherboard repair. Made for compatible Samsung Galaxy S23+ board layouts. Helps with solder-ball alignment during middle-layer rework. Suitable for mobile repair technicians and electronics workshops. Compatible Models and Layout Device: Samsung Galaxy S23+ Model: SM-S916U Additional model listed: SM-S916W Board revision/layout: REV07E W44 Product Specifications Brand: AMAOE Model: S916U-012 Type: Middle Layer BGA Reballing Stencil Application: Samsung Galaxy S23+ motherboard repair Usage Note: Match the stencil layout and motherboard revision before use. Confirm compatibility with the supplier if the board revision differs...

The AMAOE MQ-6 CPU BGA Reballing Stencil is designed for mobile phone motherboard repair and CPU reballing applications. It helps technicians align solder balls with the BGA pad layout when servicing compatible processor packages. Key Features Designed for CPU BGA reballing and chip-level repair. Supports selected Qualcomm and MediaTek IC packages. Helps achieve consistent solder-ball placement during reballing. Suitable for mobile repair technicians and electronics workshops. Compatible IC Models Qualcomm: SM6450, SM8650, SM4450 MediaTek: MT6985W, MT6781V, MT6879, MT8781V Specifications Brand: AMAOE Model: MQ-6 Type: CPU BGA Reballing Stencil Application: Mobile motherboard and IC repair Note: Check the processor marking and stencil aperture layout before use to confirm compatibility...

AMAOE M53 is a no-clean soldering flux paste designed for electronics soldering and repair work. It helps improve solder flow and wetting during component soldering and rework. The M53 flux is supplied in a 10CC syringe for controlled application. It is suitable for mobile phone and laptop motherboard repair, PCB and IC soldering, CPU, LED, SMD and BGA rework applications. Available product information describes it as a no-clean flux with minimal residue and good insulation resistance. Brand AMAOE Model M53 Type No-Clean Soldering Flux Paste Capacity 10CC Application PCB, IC, Mobile Phone, CPU, LED, SMD & BGA Repair Flux Type No-Clean Its syringe format allows precise placement of flux on small soldering areas, making it suitable for microsoldering, motherboard repair and BGA rework.  ..

AMAOE M50 is a halogen-free solder flux paste supplied in a 10CC syringe. It is designed for electronics soldering and repair work, including mobile phone and laptop motherboards, CPU and IC soldering, SMD components and BGA rework. The paste flux helps improve solder wetting and flow during soldering and rework. Its syringe format allows the flux to be applied directly and accurately to the required repair area. Package includes: 1 × AMAOE M50 10CC solder flux syringe and 2 × dispensing needles...

AMAOE F-IPLCD is a screen IC refinishing and reballing stencil designed for compatible iPhone display IC repair work. It is used with curing ink and the green oil network film to align the required pad pattern before UV curing. The stencil supports screen IC repair applications for iPhone 12, 12 Pro, 12 Pro Max, 13, 13 Pro, 13 Pro Max, 14, 14 Plus, 14 Pro, 14 Pro Max, 15, 15 Plus and 15 Pro Max models. Brand AMAOE Model F-IPLCD Application Screen IC Refinishing & Reballing Compatible Models iPhone 12–15 Pro Max Series Type Green Oil Network Film Reballing Stencil Package 1 × Stencil Usage: Apply curing ink to the required pad area, place the green oil network film for alignment, and cure it using a UV lamp according to the repair process...

The AMAOE CD3217 4-in-1 0.12mm Magnetic BGA Reballing Stencil is designed for MacBook CD3217 IC reballing work. Its 4-in-1 design provides multiple stencil layouts in one plate, while the magnetic construction helps with positioning during the reballing process. Brand AMAOE Model CD3217 Compatibility MacBook – CD3217 BGA IC Thickness 0.12mm Type 4-in-1 Magnetic BGA Reballing Stencil Package 1 × Stencil..

AMAOE E8535P 0.12mm CPU BGA Reballing Stencil The AMAOE E8535P is a 0.12mm CPU BGA reballing stencil designed for the Samsung Exynos 1350 processor. It is suitable for CPU reballing and chip-level motherboard repair. The stencil provides the required aperture pattern for E8535P CPU reballing and solder ball placement. Brand AMAOE Model E8535P Compatible CPU Samsung Exynos 1350 (E8535P) Thickness 0.12mm Type CPU BGA Reballing Stencil Package 1 × Stencil..