MECHANIC QC-20 is a specialized liquid solution designed to soften and remove hardened sealing glue and resin around BGA IC chips during mobile phone motherboard repair. It helps technicians loosen stubborn adhesive for chip-level repair and rework. Key Features Liquid glue remover for BGA IC chip repair. Helps soften hardened black glue and resin adhesives. Suitable for mobile phone motherboard repair. Works on various cured resin adhesives, including epoxy and acrylic-based adhesives. 20ml bottle for professional repair use. Specifications Brand: MECHANIC Model: QC-20 Product Type: BGA IC Glue Removing Liquid Capacity: 20ml Application: Mobile motherboard and BGA IC glue removal Safety Precautions This solution is weakly acidic. Open the bottle carefully, avoid contact with eyes and skin, and use it in a well-ventilated area. Follow the product instructions and keep it away from children. For professional repair use only.