AMAOE A17 0.12mm Lower Layer CPU BGA Reballing Stencil for iPhone 15 Pro / 15 Pro Max

Name: AMAOE A17 0.12mm Lower Layer CPU BGA Reballing Stencil for iPhone 15 Pro / 15 Pro Max
Brand: AMAOE
SKU: A17 Lower
Availability: InStock

₹249.00

Brand: AMAOE

Model: A17 Lower

Availability: In Stock

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Tags: A17 iPhone 15 Pro CPU

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Product Description

AMAOE A17 0.12mm Lower Layer CPU BGA Reballing Stencil

The AMAOE A17 is a 0.12mm lower layer CPU BGA reballing stencil designed for the Apple A17 CPU used in the iPhone 15 Pro and iPhone 15 Pro Max. It is used for CPU reballing and chip-level motherboard repair work.

The stencil provides the required aperture pattern for the A17 CPU lower layer, helping with accurate solder ball placement during the BGA reballing process.

Product Details

Brand	AMAOE
Model	A17
Compatible Models	iPhone 15 Pro / iPhone 15 Pro Max
Chip	Apple A17 CPU
Type	Lower Layer CPU BGA Reballing Stencil
Thickness	0.12mm
Package	1 × Stencil

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