AMAOE EU-4 0.12mm Exynos IC BGA Reballing Stencil for Samsung

Name: AMAOE EU-4 0.12mm Exynos IC BGA Reballing Stencil for Samsung
Brand: AMAOE
SKU: EU-4
Availability: InStock

₹179.00

Brand: AMAOE

Model: EU-4

Availability: In Stock

Qty

🚚 Check Delivery Availability

Add to wishlist
Add to compare

Tags: Samsung Exynos AMAOE EU-4 BGA

Categories Cart Account Search Recent View Go to Top

Description
Shipping Methods

Product Description

The AMAOE EU-4 0.12mm Exynos IC BGA Reballing Stencil is designed for BGA reballing and motherboard repair on compatible Samsung devices using the matching Exynos IC layout.

Key Features

Brand: AMAOE
Model: EU-4
Thickness: 0.12mm
Type: Exynos IC BGA reballing stencil
Compatible Brand: Samsung
Application: IC reballing and mobile motherboard repair

The stencil helps technicians align solder balls or solder paste with the corresponding BGA pad layout during chip rework.

Compatibility Note: Confirm the IC marking and stencil pattern before use to ensure compatibility with the Samsung motherboard being repaired.

Show More Show Less

🚚 Shipping & Delivery Information

UToolsZone Fast & Reliable Delivery

When you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.

📦 Estimated Delivery Time

Total delivery time = Processing Time + Shipping Time

📦 Processing Time

Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.

✈️ Shipping Time

Shipping time refers to the duration your package takes to travel from our warehouse to your address.

🌍 Important Note

Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.