AMAOE IP11-012 0.12mm Middle Layer BGA Reballing Stencil for iPhone 11

Name: AMAOE IP11-012 0.12mm Middle Layer BGA Reballing Stencil for iPhone 11
Brand: AMAOE
SKU: IP11-012
Availability: InStock

₹199.00

Brand: AMAOE

Model: IP11-012

Availability: In Stock

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Product Description

AMAOE IP11-012 is a 0.12mm middle layer BGA reballing stencil designed specifically for iPhone 11 motherboard repair. It is used for precise solder application during middle-layer reballing work.

The stencil is made from Japanese steel sheet with a hard, reusable construction and square apertures designed to match the required motherboard pad pattern.

Brand	AMAOE
Model	IP11-012
Thickness	0.12mm
Application	iPhone 11 Middle Layer BGA Reballing
Material	Japanese Steel Sheet
Hole Type	Square
Reusable	Yes
Package	1 × Stencil

It helps technicians apply solder paste or position solder balls accurately on the middle-layer motherboard pads during iPhone 11 reballing and repair work.

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