AMAOE MI11 0.12mm BGA Reballing Stencil for Xiaomi CC9/CC9e/A3 Redmi Note 8 SM6125 SDM710

Name: AMAOE MI11 0.12mm BGA Reballing Stencil for Xiaomi CC9/CC9e/A3 Redmi Note 8 SM6125 SDM710
Brand: AMAOE
SKU: MI-11
Availability: InStock

₹179.00

Brand: AMAOE

Model: MI-11

Availability: In Stock

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Tags: MI11 Stencil BGA Reballing CPU Stencil

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Product Description

AMAOE MI11 is a 0.12mm BGA reballing stencil designed for CPU, RAM and other BGA IC reballing work on Xiaomi and Redmi motherboards. It provides the required solder-ball pattern for precise IC reballing and motherboard repair.

The MI11 stencil supports multiple IC patterns including SM6125, SDM710, MT6785V and other compatible components. It is associated with Xiaomi CC9, CC9e, Mi 8 SE, Mi A3 and Redmi Note 8 series devices. Compatibility should be matched according to the IC or processor code before use.

Brand	AMAOE
Model	MI11 / MI-11
Thickness	0.12mm
Type	BGA Reballing Stencil
IC / CPU Support	SM6125, SDM710, MT6785V and compatible IC patterns
Compatible Devices	Xiaomi CC9, CC9e, Mi 8 SE, Mi A3, Redmi Note 8 and compatible models
Application	CPU, RAM & BGA IC Reballing
Package	1 × Stencil

The 0.12mm stencil is intended for professional mobile motherboard repair, IC reballing and microsoldering applications.

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