AMAOE MI13 0.12mm Multi-IC BGA Reballing Stencil for Redmi 9/Note 9 Series

Name: AMAOE MI13 0.12mm Multi-IC BGA Reballing Stencil for Redmi 9/Note 9 Series
Brand: AMAOE
SKU: MI-13
Availability: InStock

₹179.00

Brand: AMAOE

Model: MI-13

Availability: In Stock

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Tags: MI13 Stencil BGA254 Stencil BGA Reballing

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Product Description

AMAOE MI13 is a 0.12mm multi-IC BGA reballing stencil designed for compatible CPU and IC reballing applications. It supports MediaTek MT6769V and Qualcomm SM6115 / SM7225 platforms and is used for motherboard repair and BGA IC reballing.

Model: MI13
Thickness: 0.12mm
Main CPU Platforms: MT6769V / SM6115 / SM7225
Chipsets: MediaTek MT6769V, Snapdragon 662, Snapdragon 750G
BGA Pattern: BGA254
Compatible Devices: Redmi 9, Redmi Note 9, Redmi Note 9 4G, Redmi Note 9 Pro 5G and other compatible devices using the supported CPU platforms
Application: CPU and BGA IC Reballing
Material: Japanese Steel Sheet
Hole Type: Square
Reusable: Yes
Package: 1 × Stencil

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