AMAOE MI6 0.12mm BGA Reballing Stencil for Snapdragon 636/660 Xiaomi Mi Note 3 Mi 6X Redmi Note 5/5 Pro

AMAOE MI6 0.12mm BGA Reballing Stencil for Snapdragon 636/660 Xiaomi Mi Note 3 Mi 6X Redmi Note 5/5 Pro

β‚Ή179.00
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Model: MI-6
Availability: In Stock
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Product Description

AMAOE MI6 is a 0.12mm BGA reballing stencil designed for Qualcomm Snapdragon 636 and Snapdragon 660 IC reballing. It is suitable for motherboard repair and BGA reballing applications on compatible Xiaomi and Redmi devices.

  • Model: MI6
  • Thickness: 0.12mm
  • Compatible CPUs: Qualcomm Snapdragon 636 / Snapdragon 660
  • Compatible Devices: Xiaomi Mi Note 3, Xiaomi Mi 6X, Redmi Note 5, Redmi Note 5 Pro
  • Application: BGA IC Reballing
  • Package: 1 Γ— Stencil

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