AMAOE MQ-2 0.12mm CPU BGA Reballing Stencil for Qualcomm and MediaTek

Name: AMAOE MQ-2 0.12mm CPU BGA Reballing Stencil for Qualcomm and MediaTek
Brand: AMAOE
SKU: MQ-2
Availability: InStock

₹179.00

Brand: AMAOE

Model: MQ-2

Availability: In Stock

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Tags: CPU BGA Stencil AMAOE MQ2 CPU Reballing

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Description
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Product Description

The AMAOE MQ-2 CPU BGA Reballing Stencil is designed for reballing compatible Qualcomm and MediaTek (MTK) processor ICs during mobile motherboard repair. It helps technicians align solder-ball placement with the matching BGA pad pattern.

Supported IC Models

MediaTek (MTK)

MT6779V
MT6768
MT6765

Qualcomm

SDM439
MSM8909W

Product Specifications

Brand: AMAOE
Model: MQ-2
Product Type: CPU BGA Reballing Stencil
Compatible Platforms: Qualcomm and MediaTek
Application: CPU BGA reballing and motherboard-level repair
Package Contents: 1 × AMAOE MQ-2 stencil

Important: Confirm the exact IC marking and match its BGA pad layout with the stencil before use. Compatibility depends on the chip package and stencil pattern.

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🌍 Important Note

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