AMAOE MQ-3 CPU BGA Reballing Stencil for Qualcomm and MediaTek

Name: AMAOE MQ-3 CPU BGA Reballing Stencil for Qualcomm and MediaTek
Brand: AMAOE
SKU: MQ-3
Availability: InStock

₹179.00

Brand: AMAOE

Model: MQ-3

Availability: In Stock

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Tags: CPU BGA Stencil AMAOE MQ3 CPU Reballing

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Description
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Product Description

The AMAOE MQ-3 CPU BGA Reballing Stencil is designed for reballing compatible processor ICs during mobile motherboard repair. It helps technicians align solder-ball placement with the corresponding BGA pad pattern.

Supported IC Models

Qualcomm Snapdragon 865 (SM8250)
Qualcomm SM7250
Qualcomm SM7150
Qualcomm SM6150
MediaTek MT6885Z

Product Specifications

Brand: AMAOE
Model: MQ-3
Product Type: CPU BGA Reballing Stencil
Compatible Platforms: Qualcomm and MediaTek
Application: CPU BGA reballing and motherboard repair
Package Contents: 1 × AMAOE MQ-3 stencil

Important: Check the exact IC marking and match the BGA pad layout with the stencil before use. Compatibility depends on the chip package and stencil pattern. This product listing is for the stencil only.

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🚚 Shipping & Delivery Information

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📦 Estimated Delivery Time

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✈️ Shipping Time

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🌍 Important Note

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