AMAOE MT6781V MediaTek CPU BGA Reballing Stencil for Mobile Phone Motherboard Repair

Name: AMAOE MT6781V MediaTek CPU BGA Reballing Stencil for Mobile Phone Motherboard Repair
Brand: AMAOE
SKU: MT6781V
Availability: InStock

₹249.00

Brand: AMAOE

Model: MT6781V

Availability: In Stock

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Description
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Product Description

The AMAOE MT6781V CPU BGA Reballing Stencil is intended for chip-level mobile phone motherboard repair involving compatible MediaTek processor packages. It helps technicians align solder balls with the CPU's BGA pad layout during reballing work.

Key Features

Designed for CPU BGA reballing applications.
Made for compatible MediaTek MT6781V processor layouts.
Helps with solder-ball alignment during chip rework.
Suitable for mobile phone repair technicians and electronics workshops.

Product Specifications

Brand: AMAOE
IC Model: MT6781V
Product Type: CPU BGA Reballing Stencil
Application: Mobile motherboard repair and CPU reballing

Usage Note: Confirm the processor marking and stencil aperture pattern before use. Stencil thickness and package contents should be verified with the supplier.

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🚚 Shipping & Delivery Information

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📦 Estimated Delivery Time

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Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.

✈️ Shipping Time

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🌍 Important Note

Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.