AMAOE QU-2 0.12mm Qualcomm CPU BGA Reballing Stencil

Name: AMAOE QU-2 0.12mm Qualcomm CPU BGA Reballing Stencil
Brand: AMAOE
SKU: QU-2
Availability: InStock

₹179.00

Brand: AMAOE

Model: QU-2

Availability: In Stock

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Tags: Qualcomm CPU AMAOE QU-2 BGA

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Description
Shipping Methods

Product Description

The AMAOE QU-2 Qualcomm CPU BGA Reballing Stencil is designed for mobile phone motherboard chip-level repair and CPU reballing work.

Product Specifications

Brand: AMAOE
Model: QU-2
Thickness: 0.12mm
Type: Qualcomm CPU BGA Reballing Stencil
Material: Stainless steel

Supported Chip Models

MSM8953 B01
MSM8953 1AB
MSM8937
MSM8916
MSM8998 A
MSM8998 B

Applications

Qualcomm CPU BGA reballing
Mobile motherboard chip-level repair
Reapplying solder balls to compatible CPU chips

Compatibility Note: Before use, confirm the chip model and BGA layout match the stencil pattern.

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🚚 Shipping & Delivery Information

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When you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.

📦 Estimated Delivery Time

Total delivery time = Processing Time + Shipping Time

📦 Processing Time

Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.

✈️ Shipping Time

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🌍 Important Note

Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.