AMAOE SAM1 0.12mm MSM8998 CPU BGA Reballing Stencil for Samsung Galaxy S8, S8+ and Note8

AMAOE SAM1 0.12mm MSM8998 CPU BGA Reballing Stencil for Samsung Galaxy S8, S8+ and Note8

Brand:
Model: SAM-1
Availability: 2-3 Days
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Product Description

The AMAOE SAM1 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible Samsung Galaxy devices using the Qualcomm MSM8998 processor layout specified for this stencil.

Key Features

  • Brand: AMAOE
  • Model: SAM1
  • Thickness: 0.12mm
  • Processor: Qualcomm MSM8998
  • Type: Multi-function CPU BGA reballing stencil
  • Listed Compatible Models: Samsung Galaxy S8, S8 Plus and Note8
  • Application: CPU reballing and mobile motherboard repair

The stencil helps technicians align solder balls or solder paste with the matching BGA layout during CPU rework.

Compatibility Note: Verify the processor marking and BGA pattern on the motherboard before use, as device variants may differ.

🚚 Shipping & Delivery Information

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