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AMAOE SAM19 CPU BGA Reballing Stencil for Samsung Galaxy S23 and S24 Series
βΉ179.00
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Product Description
The AMAOE SAM19 CPU BGA Reballing Stencil is designed for CPU reballing and chip-level motherboard repair on compatible Samsung Galaxy devices. It is listed for Qualcomm Snapdragon processor platforms, including the Snapdragon 8 Gen 2 (SM8550) and Snapdragon 8 Gen 3 (SM8650).
Key Features
- Brand: AMAOE
- Model: SAM19
- Type: CPU BGA reballing stencil
- Supported Processors: Snapdragon 8 Gen 2 (SM8550) and Snapdragon 8 Gen 3 (SM8650)
- Listed Compatible Devices: Samsung Galaxy S23, S23 Ultra, S24 and S24 Ultra
- Application: CPU reballing and smartphone motherboard repair
The stencil helps technicians align solder balls or solder paste with the corresponding CPU BGA pattern during chip rework.
Compatibility Note: Processor and motherboard layouts can differ between device variants. Confirm the installed chipset and stencil pattern before use.
π Shipping & Delivery Information
UToolsZone Fast & Reliable DeliveryWhen you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.

π¦ Estimated Delivery Time
Total delivery time = Processing Time + Shipping Timeπ¦ Processing Time
Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.βοΈ Shipping Time
Shipping time refers to the duration your package takes to travel from our warehouse to your address.π Important Note
Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.Thank you for shopping with UToolsZone β€οΈ
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