AMAOE SM8450 0.12mm Snapdragon 8 Gen 1 CPU Upper and Lower Layer BGA Reballing Stencil

Name: AMAOE SM8450 0.12mm Snapdragon 8 Gen 1 CPU Upper and Lower Layer BGA Reballing Stencil
Brand: AMAOE
SKU: SM8450
Availability: InStock

₹179.00

Brand: AMAOE

Model: SM8450

Availability: In Stock

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Tags: SM8450 CPU AMAOE Stencil BGA

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Description
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Product Description

The AMAOE SM8450 0.12mm BGA Reballing Stencil is designed for CPU reballing and motherboard repair involving the Qualcomm Snapdragon 8 Gen 1 (SM8450) processor. It supports upper and lower layer BGA rework according to the matching stencil layout.

Key Features

Brand: AMAOE
Model: SM8450
Thickness: 0.12mm
Processor: Qualcomm Snapdragon 8 Gen 1 (SM8450)
Type: CPU BGA reballing stencil
Layer Support: Upper and lower layer
Application: CPU reballing and smartphone motherboard repair

The stencil helps technicians align solder balls or solder paste with the corresponding BGA pattern during CPU rework.

Compatibility Note: Verify the processor marking and required upper or lower layer pattern before use to ensure the stencil matches the motherboard.

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