AMAOE U-QSD4 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil

AMAOE U-QSD4 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil

β‚Ή199.00
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Model: U-QSD4
Availability: In Stock
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Product Description

AMAOE U-QSD4 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil

The AMAOE U-QSD4 is a multi-pattern BGA reballing stencil for mobile motherboard repair. It is designed for selected Qualcomm Snapdragon CPUs and supporting ICs, helping technicians restore solder ball patterns during chip-level repairs.

Supported IC Models

  • CPU: MSM8953, MSM8937, MSM8940, MSM8917, SDM632, SDM450
  • Power ICs: PM8937, PM8940, PMI8940, PMI8942, PM8953, PMI632
  • Other ICs: WTR2965, WCN3615, RF5428, RF5212A, 56020, BGA153, BGA178, BGA221

Specifications: Model U-QSD4, 0.12 mm thickness.

Note: Verify the IC marking and stencil pattern before use.

🚚 Shipping & Delivery Information

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When you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.
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🌍 Important Note

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