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AMAOE Universal BGA Reballing Stencil 0.3mm, 0.35mm, 0.4mm & 0.5mm
βΉ199.00
βΉ249.00
-20%
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Product Description
AMAOE Universal BGA Reballing Stencil
The AMAOE Universal BGA Reballing Stencil is a multi-function stencil designed for mobile phone motherboard repair. It supports multiple solder ball pitches, making it useful for technicians working with compatible BGA chips during chip-level repairs.
Key Features.
- Supports 0.3 mm, 0.35 mm, 0.4 mm and 0.5 mm solder ball pitches
- Includes parallel-hole and 45-degree hole patterns
- Suitable for compatible CPU, eMMC, UFS and power IC reballing
- Square-hole design for solder ball placement
- Reusable stainless steel construction
Specifications: Brand AMAOE, multi-function universal stencil, 0.12 mm thickness.
Note: Choose the correct hole pattern and solder ball size for the IC package before reballing.
π Shipping & Delivery Information
UToolsZone Fast & Reliable DeliveryWhen you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.

π¦ Estimated Delivery Time
Total delivery time = Processing Time + Shipping Timeπ¦ Processing Time
Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.βοΈ Shipping Time
Shipping time refers to the duration your package takes to travel from our warehouse to your address.π Important Note
Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.Thank you for shopping with UToolsZone β€οΈ
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