AMAOE MI16 0.12mm Dimensity 8100/9000 CPU BGA Reballing Stencil for Redmi K50 Series & Note 11 Pro

Name: AMAOE MI16 0.12mm Dimensity 8100/9000 CPU BGA Reballing Stencil for Redmi K50 Series & Note 11 Pro
Brand: AMAOE
SKU: MI-16
Availability: InStock

₹179.00

Brand: AMAOE

Model: MI-16

Availability: In Stock

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Tags: MI16 Stencil Dimensity Stencil BGA Reballing

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Product Description

AMAOE MI16 is a 0.12mm CPU BGA reballing stencil designed for MediaTek Dimensity 8100 and Dimensity 9000 processor platforms. It supports MT6895Z and MT6983Z CPU layouts and is suitable for CPU, RAM and supporting IC reballing during Xiaomi and Redmi motherboard repair.

Model: MI16
Thickness: 0.12mm
CPU Platforms: MediaTek Dimensity 8100 / Dimensity 9000
Chip Codes: MT6895Z / MT6983Z
Compatible Devices: Redmi K50, Redmi K50 Pro, Redmi Note 11 Pro, Redmi Note 11 Pro+, Xiaomi 12 Pro Dimensity Edition
Supported Patterns: CPU, RAM, BGA153 and multiple supporting IC layouts
Application: CPU, RAM and BGA IC Reballing
Package: 1 × Stencil

The stencil is designed to match the BGA pad layout of the supported processor and memory packages for accurate solder-ball placement during reballing work.

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