AMAOE U-QSD9 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil

Name: AMAOE U-QSD9 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil
Brand: AMAOE
SKU: U-QSD9
Availability: InStock

₹199.00

Brand: AMAOE

Model: U-QSD9

Availability: In Stock

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Tags: CPU Reballing RAM Repair BGA Stencil

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Product Description

AMAOE U-QSD9 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil

The AMAOE U-QSD9 is a multi-pattern BGA reballing stencil designed for Qualcomm Snapdragon motherboard repair. It supports CPU, RAM and related IC layouts used in chip-level mobile phone servicing.

Supported IC Models

CPU: SM8250 (Snapdragon 865), SM8250-002 (Snapdragon 870)
RAM: RAM496, RAM556
Power ICs: PM8150A, PM8150B, PM8250
Other ICs: QCA6391, QPM5679, SDX865, SDX55M, DA9313, PMX55, PMW5100, WCD9385, 78190-31, 77040, BGA153

Specifications: Model U-QSD9, 0.12 mm thickness.

Note: Check the IC marking and matching stencil pattern before use.

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🚚 Shipping & Delivery Information

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When you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.

📦 Estimated Delivery Time

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📦 Processing Time

Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.

✈️ Shipping Time

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🌍 Important Note

Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.