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AMAOE SAM1 0.12mm MSM8998 CPU BGA Reballing Stencil for Samsung Galaxy S8, S8+ and Note8
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Product Description
The AMAOE SAM1 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible Samsung Galaxy devices using the Qualcomm MSM8998 processor layout specified for this stencil.
Key Features
- Brand: AMAOE
- Model: SAM1
- Thickness: 0.12mm
- Processor: Qualcomm MSM8998
- Type: Multi-function CPU BGA reballing stencil
- Listed Compatible Models: Samsung Galaxy S8, S8 Plus and Note8
- Application: CPU reballing and mobile motherboard repair
The stencil helps technicians align solder balls or solder paste with the matching BGA layout during CPU rework.
Compatibility Note: Verify the processor marking and BGA pattern on the motherboard before use, as device variants may differ.
π Shipping & Delivery Information
UToolsZone Fast & Reliable DeliveryWhen you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.

π¦ Estimated Delivery Time
Total delivery time = Processing Time + Shipping Timeπ¦ Processing Time
Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.βοΈ Shipping Time
Shipping time refers to the duration your package takes to travel from our warehouse to your address.π Important Note
Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.Thank you for shopping with UToolsZone β€οΈ
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