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AMAOE EU-3 0.12mm Exynos IC BGA Reballing Stencil for Samsung
βΉ179.00
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Product Description
The AMAOE EU-3 0.12mm CPU BGA Reballing Stencil is designed for Samsung Exynos processor and RAM reballing during mobile motherboard repair. It supports multiple Exynos IC layouts, making it suitable for technicians working on compatible Samsung devices.
Key Features
- Brand: AMAOE
- Model: EU-3
- Thickness: 0.12mm
- Material: Japanese steel sheet
- Type: CPU and RAM BGA reballing stencil
- Supported ICs: Exynos 7885 CPU/RAM, Exynos 9820, Exynos 9610 CPU/RAM, Exynos 990 CPU/RAM and Exynos 980
- Application: IC reballing and Samsung motherboard repair
The stencil helps align solder balls or solder paste with the matching BGA pad pattern during IC rework.
Compatibility Note: Verify the IC model and stencil layout before use to ensure the correct pattern is selected.
π Shipping & Delivery Information
UToolsZone Fast & Reliable DeliveryWhen you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.

π¦ Estimated Delivery Time
Total delivery time = Processing Time + Shipping Timeπ¦ Processing Time
Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.βοΈ Shipping Time
Shipping time refers to the duration your package takes to travel from our warehouse to your address.π Important Note
Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.Thank you for shopping with UToolsZone β€οΈ
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