AMAOE OV-5 0.12mm CPU BGA Reballing Stencil for OPPO and VIVO

Name: AMAOE OV-5 0.12mm CPU BGA Reballing Stencil for OPPO and VIVO
Brand: AMAOE
SKU: OV-5
Availability: InStock

₹179.00

Brand: AMAOE

Model: OV-5

Availability: In Stock

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Tags: OPPO VIVO AMAOE OV-5 BGA

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Description
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Product Description

The AMAOE OV-5 0.12mm CPU BGA Reballing Stencil is designed for CPU, RAM and motherboard IC reballing on compatible OPPO and VIVO smartphones. It supports multiple Qualcomm and MediaTek chip layouts used in the listed devices.

Key Features

Brand: AMAOE
Model: OV-5
Thickness: 0.12mm
Type: Universal CPU, RAM and IC BGA reballing stencil
Supported Processors: Snapdragon 765G (SM7250) and MediaTek Dimensity 1000L (MT6855Z)
Supported ICs: MT6885Z CPU/RAM, PM7250, PM7150A, MT6359VPP, MT6190W, MT6635XP and other listed IC layouts
Compatible OPPO Models: Reno3, Reno3 Pro, Reno4 and Reno4 Pro
Compatible VIVO Models: X50, X50 Pro, Z6 and iQOO Z1x
Application: CPU/RAM reballing and smartphone motherboard repair

The stencil helps technicians align solder balls or solder paste with the corresponding BGA pad layout during chip rework.

Compatibility Note: Check the IC marking and stencil pattern before use. Compatibility depends on the specific motherboard and component layout.

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