AMAOE OV-9 0.12mm CPU BGA Reballing Stencil for MediaTek Dimensity 9200 Smartphones

Name: AMAOE OV-9 0.12mm CPU BGA Reballing Stencil for MediaTek Dimensity 9200 Smartphones
Brand: AMAOE
SKU: OV-9
Availability: InStock

₹179.00

Brand: AMAOE

Model: OV-9

Availability: In Stock

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Description
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Product Description

The AMAOE OV-9 CPU BGA Reballing Stencil is designed for mobile phone motherboard repair and compatible MediaTek processor reballing. It helps technicians align solder balls with the processor's BGA pad layout during chip-level repair.

Key Features

Designed for CPU BGA reballing and motherboard repair.
0.12 mm thickness as specified in the supplied product title.
Intended for compatible MediaTek Dimensity processor layouts.
Suitable for professional mobile repair and chip-level rework.

Compatible Processor and Device Information

Processor: MediaTek Dimensity 9200
IC model listed: MT6985W
Device models listed by supplier: vivo X90, OPPO Find X6, iQOO Neo8 Pro

Product Specifications

Brand: AMAOE
Model: OV-9
Thickness: 0.12 mm
Product Type: CPU BGA Reballing Stencil
Application: Mobile motherboard repair and CPU reballing

Important Note: Verify the exact processor marking and stencil aperture pattern before use. Smartphone variants can have different processor configurations, so confirm compatibility with the actual board.

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🚚 Shipping & Delivery Information

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📦 Estimated Delivery Time

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📦 Processing Time

Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.

✈️ Shipping Time

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🌍 Important Note

Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.