AMAOE S901U-012 0.12mm Middle Layer BGA Reballing Stencil for Samsung Galaxy S22 Series

Name: AMAOE S901U-012 0.12mm Middle Layer BGA Reballing Stencil for Samsung Galaxy S22 Series
Brand: AMAOE
SKU: SM-S901U
Availability: InStock

₹199.00

Brand: AMAOE

Model: SM-S901U

Availability: In Stock

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Tags: AMAOE S901U-012 Samsung S22 Middle Layer Stencil

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Description
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Product Description

The AMAOE S901U-012 Middle Layer BGA Reballing Stencil is designed for motherboard repair and middle-layer reballing work on compatible Samsung Galaxy S22 series boards. It helps technicians align solder balls with the corresponding board layout during layer rework.

Key Features

Designed for middle-layer BGA reballing and motherboard repair.
0.12 mm stencil thickness as specified in the supplied product title.
Intended for compatible Samsung Galaxy S22 series board layouts.
Suitable for professional mobile repair and chip-level rework.

Compatible Models Listed

Samsung Galaxy S22 — SM-S901U
Samsung Galaxy S22+ — SM-S906U
Additional model suffixes listed by the supplier: W, 0, D and E

Product Specifications

Brand: AMAOE
Model: S901U-012
Thickness: 0.12 mm
Type: Middle Layer BGA Reballing Stencil
Application: Samsung motherboard middle-layer repair

Important Note: Confirm the complete Samsung model number and stencil layout before use. The supplied title groups multiple model suffixes together; verify exact compatibility with the supplier before listing all of them.

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🚚 Shipping & Delivery Information

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✈️ Shipping Time

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🌍 Important Note

Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.