AMAOE SAM15 0.12mm CPU BGA Reballing Stencil for Samsung Galaxy S21 Series

AMAOE SAM15 0.12mm CPU BGA Reballing Stencil for Samsung Galaxy S21 Series

β‚Ή179.00
Brand:
Model: SAM-15
Availability: In Stock
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Product Description

The AMAOE SAM15 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard-level repair on compatible Samsung Galaxy S21 series devices. It helps mobile repair technicians align solder balls or solder paste with the matching BGA contact pattern during chip rework.

Key Features

  • Brand: AMAOE
  • Model: SAM15
  • Thickness: 0.12mm
  • Type: CPU BGA reballing stencil
  • Compatible Series: Samsung Galaxy S21, S21+ and S21 Ultra
  • Application: CPU reballing and smartphone motherboard repair

Compatibility Note: CPU layouts can vary between regional variants and motherboard revisions. Verify the processor marking and stencil pattern before use.

🚚 Shipping & Delivery Information

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