AMAOE SAM21 CPU BGA Reballing Stencil for Samsung Galaxy S25 and S25+

Name: AMAOE SAM21 CPU BGA Reballing Stencil for Samsung Galaxy S25 and S25+
Brand: AMAOE
SKU: SAM-21
Availability: InStock

₹199.00 ₹249.00 -20%

Brand: AMAOE

Model: SAM-21

Availability: In Stock

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Tags: Samsung S25 AMAOE SAM21 BGA

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Description
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Product Description

The AMAOE SAM21 CPU BGA Reballing Stencil is designed for CPU reballing and chip-level motherboard repair on compatible Samsung Galaxy S25 series devices. It is listed for the Qualcomm Snapdragon 8 Elite (SM8750) processor platform.

Key Features

Brand: AMAOE
Model: SAM21
Type: CPU BGA reballing stencil
Supported Processor: Qualcomm Snapdragon 8 Elite (SM8750)
Compatible Devices: Samsung Galaxy S25 and Galaxy S25+
Application: CPU reballing and smartphone motherboard repair

The stencil helps technicians align solder balls or solder paste with the matching CPU BGA contact pattern during chip rework.

Compatibility Note: Confirm the installed processor and BGA layout before use. Compatibility may vary by device variant and motherboard revision.

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📦 Estimated Delivery Time

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Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.

✈️ Shipping Time

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🌍 Important Note

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