AMAOE SAM4 0.12mm Exynos CPU BGA Reballing Stencil for Samsung Galaxy A7, A5, A3, S5 and J7

Name: AMAOE SAM4 0.12mm Exynos CPU BGA Reballing Stencil for Samsung Galaxy A7, A5, A3, S5 and J7
Brand: AMAOE
SKU: SAM-4
Availability: InStock

₹199.00

Brand: AMAOE

Model: SAM-4

Availability: In Stock

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Tags: Samsung A7 AMAOE SAM4 BGA

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Description
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Product Description

The AMAOE SAM4 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible Samsung Galaxy devices using supported Exynos processor layouts. It is a multi-function stencil for chip-level repair work where the matching BGA pattern is required.

Key Features

Brand: AMAOE
Model: SAM4
Thickness: 0.12mm
Type: Multi-function CPU BGA reballing stencil
Supported Processors: Exynos 3470, Exynos 7580 and Exynos 7880, as listed by the supplier
Listed Compatible Models: Samsung Galaxy A7, A5, A3, S5 and J7
Application: CPU reballing and mobile motherboard repair

The stencil helps technicians position solder balls or solder paste according to the matching BGA layout during CPU rework.

Compatibility Note: Check the processor marking and BGA layout before use. Samsung devices may have different processor variants, so confirm that the stencil pattern matches the motherboard being repaired.

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