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AMAOE 0.12mm BGA Reballing Stencil for A1707 Hard Disk Master IC The AMAOE A1707 is a 0.12mm BGA reballing stencil designed for A1707 Hard Disk Master IC repair work. It is available in two different stencil options: CPU and RAM. Choose the required Stencil Type — CPU or RAM — according to the IC you need to reball. Each option is a dedicated stencil pattern for its respective IC. Available Stencil Types ``` CPU: A1707 CPU BGA reballing stencil RAM: A1707 RAM BGA reballing stencil Product Details ``` Brand AMAOE Model A1707 Stencil Type CPU / RAM Thickness 0.12mm Application BGA Reballing & IC Repair Select the correct option before ordering: Choose CPU for the CPU stencil or RAM for the RAM stencil...

AMAOE A17 0.12mm Lower Layer CPU BGA Reballing Stencil The AMAOE A17 is a 0.12mm lower layer CPU BGA reballing stencil designed for the Apple A17 CPU used in the iPhone 15 Pro and iPhone 15 Pro Max. It is used for CPU reballing and chip-level motherboard repair work. The stencil provides the required aperture pattern for the A17 CPU lower layer, helping with accurate solder ball placement during the BGA reballing process. Product Details Brand AMAOE Model A17 Compatible Models iPhone 15 Pro / iPhone 15 Pro Max Chip Apple A17 CPU Type Lower Layer CPU BGA Reballing Stencil Thickness 0.12mm Package 1 × Stencil..

AMAOE A17 RAM 0.12mm Upper Layer BGA Reballing Stencil The AMAOE A17 RAM is a 0.12mm upper layer BGA reballing stencil designed for Apple A17 RAM reballing work. It is suitable for chip-level motherboard repair and RAM reballing. The stencil provides the required aperture pattern for solder ball placement on the A17 RAM upper layer during BGA reballing. Brand AMAOE Model A17 RAM Compatible IC Apple A17 RAM Thickness 0.12mm Type Upper Layer BGA Reballing Stencil Package 1 × Stencil..

AMAOE DDR BGA178 BGA Reballing Stencil The AMAOE DDR BGA178 is a BGA reballing stencil designed for DDR BGA178 IC chip soldering and reballing work. It helps position solder balls during the reballing process. Brand AMAOE Model DDR BGA178 Application DDR BGA178 IC reballing Type BGA Reballing Stencil..

The AMAOE SAM22 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and chip-level motherboard repair on compatible Samsung Galaxy A17 devices. It is listed for selected processor layouts, including MT6789V, SM6475 and MT6769V. Key Features Brand: AMAOE Model: SAM22 Thickness: 0.12mm Type: CPU BGA reballing stencil Listed Processor Codes: MT6789V, SM6475 and MT6769V Compatible Device: Samsung Galaxy A17, subject to processor and board layout Application: CPU reballing and mobile motherboard repair The stencil helps technicians align solder balls or solder paste with the matching BGA contact pattern during chip rework. Compatibility Note: Processor codes can correspond to different device platforms. Confirm the actual chipset marking and stencil layout against the motherboard before use...