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MECHANIC UV-559 100G FLUX PASTE MECHANIC UV-559 is a professional no-clean solder flux designed for BGA rework, PCB repair, mobile motherboard maintenance, and precision electronic soldering applications. ★ High Performance Soldering Flux Helps solder flow smoothly and evenly during repair work, reducing the possibility of poor solder joints and improving soldering efficiency. ★ No-Clean Formula Specially formulated to leave minimal residue after soldering, helping maintain a cleaner working area with low smoke generation and reduced odor. ★ Suitable for Precision Electronics Widely used for mobile phones, tablet motherboards, PCB repair, BGA rework, PGA components, and various SMD soldering applications. ★ High Insulation Performance Provides high surface insulation resistance after soldering, helping reduce electrical interference in electronic communication devices. ★ Advanced Flux Composition Made using a refined solder flux formula that offers stable storage performance, excellent soldering capability, and consistent application results. 📋 Specifications Model: UV-559 Brand: MECHANIC Color: Milky White Type: No-Clean Flux Environmental Standard: Lead-Free Certification: RoHS Compliant Application: Industrial Use Only Weight: Approx. 100g 📦 Package Includes 1 × MECHANIC UV-559 No-Clean Lead-Free Solder Flux (100g)..

2UUL BH11 Universal Phone Board Mid Frame Reballing Magnetic Platform ✅ Main Features Strong built-in magnetic adsorption automatically holds the motherboard and stencil firmly in position. Designed for middle-layer reballing, BGA rework, CPU, IC and chip tin planting applications. Two platform groove depths (1mm and 2mm) support different motherboard and chip thicknesses. High-temperature resistant construction allows direct hot air gun operation during repair. Ensures precise alignment between stencil and pad for more uniform solder balls. Helps prevent stencil bulging and improves stencil service life. Compatible with both iPhone and Android motherboard repair applications. 🔧 Suitable Applications Phone motherboard middle layer reballing CPU and IC chip tin planting BGA rework and soldering Micro-soldering repair work PCB positioning and fixing iPhone and Android board maintenance 📋 Specifications Brand: 2UUL Model: BH11 Type: Universal Magnetic Reballing Platform Groove Depth: 1mm & 2mm Heat Resistance: Yes Compatibility: Universal 📦 Package Includes 1 × 2UUL BH11 Universal Magnetic Platform 2 × Tin Scrapers / Blades Video Download Link: https://vimeo.com/2uul/download/766033574/719b724080..

2UUL BH15 MagGrid Pad Chip Silicone Buffer Soldering Pad ✅ Key Features Made from heat-resistant silicone material for high-temperature soldering and repair applications. MagGrid structure provides stable support and cushioning for delicate chips and electronic components. Helps protect BGA chips, CPUs and ICs from scratches and mechanical damage during maintenance. Easy to clean and resistant to solder flux, oil and residue. Compact design makes it suitable for precision repair and micro-soldering work. 🔧 Suitable For BGA chip repair and reballing CPU and IC maintenance Chip soldering and replacement Hard disk PCB repair Micro-soldering operations Protection and support of sensitive components 📋 Specifications Brand: 2UUL Model: BH15 Type: Magnetic Silicone Buffer Pad Material: Heat-Resistant Silicone Application: BGA, Hard Disk, CPU & IC Repair 📦 Package Includes 1 × 2UUL BH15 MagGrid Pad Chip Silicone Buffer Soldering Pad  ..

2UUL BH17 CPU Reball Base Magnetic Dual Sided BGA Reballing Platform Set for iPhone / Android Key Specifications & Components Model: BH17 (Cpureball Base). Structure: CNC-machined aluminum alloy body with a dual-sided magnetic frame for maximum stability. Included Stencils: Typically comes with 75 precision CPU stencils covering a wide range of chipsets. Stencil Thickness: Includes options for 0.12mm (some kits specify T0.6 for Apple and T0.35 for Android) to handle various reballing requirements. Dimensions: Platform size is approximately 58 × 58 × 11 mm with a net weight of 238g.  Features and Benefits Magnetic Locking: Features a powerful dual-sided magnetic system that holds both the CPU and the stencil firmly in place, preventing shifting during heating. High Compatibility: Supports a broad spectrum of mobile processors, including Apple A-series (A10 to A19), Qualcomm Snapdragon (up to SM8750/Snapdragon 8 Ultra), MediaTek (MTK), and Samsung Exynos. Efficiency: The dual-sided design allows technicians to switch between different chip types quickly without losing alignment, increasing workflow throughput. Thermal Contact: Engineered for improved thermal contact and heat resistance, ensuring the platform does not warp or lose magnetic strength during hot-air reflow.  Usage Tips Preparation: Always place the platform on a flat, stable work surface. Alignment: Carefully align the CPU and the magnetic stencil before applying heat to ensure even solder ball distribution. Heat Management: Avoid excessive hot air pressure which can cause "stencil lift." Do not overheat the base excessively to preserve the life of the internal magnets. Maintenance: Clean stencils thoroughly after each use with a suitable solvent (like Relife RL-055 dispenser bottle) to maintain aperture accurac..

2UUL SC11 ECO Solder Flux 10cc is an eco-friendly, lead-free flux designed for high-quality, reliable soldering in electronic applications.   Eco-Friendly: Formulated with environmentally safe ingredients. Lead-Free: Complies with RoHS regulations for safe, lead-free soldering. High Performance: Ensures smooth and reliable solder joints. Non-Corrosive: Prevents corrosion of components and circuits. Low Fume: Emits minimal smoke and fumes during use. Fast Activation: Quickly promotes the flow of solder for efficient work. Precision Application: Convenient 10cc packaging for controlled dispensing. Versatile: Suitable for a wide range of electronic soldering applications. Safe to Handle: Non-toxic, making it safe for both the user and the environment. Ideal for Repairs: Perfect for small-scale and detailed electronic soldering tasks.   Packing Details: * 1x2UUL SC11 ECO SOLDER FLUX 10CC..

FLUX AT THE READY - The 2UUL FLUUX SC12 Soldering Flux leaves minimum residue, no need for intense cleaning LOW CLEANING - The 2UUL FLUUX SC12 soldering flux is a liquid flux and is used to repair joints very easily with it€š¬€ž¢s no-clean flux formula, it is mainly used by many good technicians STRONG AND DURABLE- This soldering flux gives your soldering a tidy and smooth welding surface. EASY TO USE - Easy to apply and store. Ideal for soldering mobile cell phone PCB and SMD like BGA, PGA, etc..   Package Contents: 1 x 2UUL FLUUX SC12 Soldering Flux 10cc..

2UUL × Union Repair SF99 Soldering Flux (2PCS/Box) The 2UUL × Union Repair SF99 Soldering Flux is specially formulated for precision electronics repair, providing excellent solder flow and reliable performance during BGA, SMD and PCB soldering operations. 🔥 Professional Repair Formula Designed for mobile phone motherboard repair and micro-soldering applications, helping achieve smooth and consistent solder joints. 💨 Low Residue & No-Clean Performance The SF99 formula produces minimal residue after soldering and helps maintain a cleaner work area with reduced smoke generation. 🔬 Suitable for Precision Components Ideal for BGA rework, SMD components, IC soldering, PCB maintenance, and mobile phone repair applications. ⚡ Stable High-Temperature Performance Maintains effective activity during heating and assists in reducing oxidation for improved soldering quality. 🛠 Wide Application Suitable for smartphones, tablets, motherboard repair, precision electronics, and professional maintenance work. 📦 Package Includes 2 × 2UUL Union Repair SF99 Soldering Flux Syringes (2PCS / Box)..

AIFEN 861DW Hot Air Gun BGA SMD Rework Station The AIFEN 861DW is a professional hot air rework station with a maximum power of 700W, designed for precise temperature and airflow control during SMD and BGA rework. It supports both direct and spiral airflow by changing the hot air nozzle and provides three independent memory channels for convenient operation. Features Direct & Spiral Airflow: Change the hot air nozzle to switch between direct and spiral airflow according to your working requirements. Brushless Fan: Integrated air outlet design provides a large and soft airflow. 3 Memory Channels: Independently set and store temperature and airflow settings for frequently used applications. Precise Temperature & Airflow Adjustment: Button controls allow convenient and accurate adjustment of temperature and airflow. Magnetic Handle Control: When the handle is placed on the holder, the station automatically enters sleep mode. Closed-Loop Temperature Control: The temperature control system provides fast heating along with convenient, accurate and stable temperature adjustment. Automatic Cooling: The system provides high-airflow cooling to help protect the hot air handle and extend the life of the heating element. Temperature Calibration: Allows adjustment of temperature accuracy when required. °C / °F Conversion: Switch between Celsius and Fahrenheit temperature display. Buzzer Control: Buzzer can be switched on or off according to preference. Specifications Model AIFEN 861DW Maximum Power 700W Temperature Range 100°C–500°C / 212°F–932°F Air Volume Range 20–100 Input Voltage AC 220V, 50/60Hz American Version AC 110V, 50/60Hz Dimensions 175 × 245 × 175mm Weight 3.8kg Packing Size 305 × 280 × 235mm Included Air Nozzles The package includes 7 air nozzles wi..

AIFEN A9 Pro Smart Soldering Station The AIFEN A9 Pro is a 120W soldering station designed for phone, BGA and PCB repair work. It uses program-controlled temperature regulation for fast and precise heating and supports C115, C210 and C245 soldering handles. Designed for Precise Soldering Unlike traditional AC voltage temperature control, the A9 Pro uses a program chip to control the temperature. This provides fast heating and accurate temperature regulation, with the manufacturer stating that the solder can melt in approximately 2 seconds. The station also features automatic sleep operation. When the handle is placed on its stand, it enters sleep mode automatically, and heating resumes when the handle is lifted. Main Functions Temperature Compensation Automatically compensates the soldering tip temperature during soldering to help maintain the selected temperature. Automatic Sleep The handle enters sleep mode when placed on the bracket and heats again when lifted. Mechanical Short-Circuit Protection Automatically stops operation in the event of a short circuit to protect the machine. Four Standby Temperatures Includes standby temperature settings of 0°C, 150°C, 180°C and 200°C, adjustable according to your requirements. Control & Convenience The A9 Pro includes practical control functions for everyday repair work: ✓ Key Lock ✓ Celsius / Fahrenheit Conversion ✓ Buzzer Function ✓ Adjustable Standby Temperature Specifications Power 120W Maximum Input Voltage AC 110V / 220V Frequency 50–60Hz Temperature Range 100°C–450°C / 212°F–842°F Product Size 24 × 21 × 17.7cm Handle Compatibility The AIFEN A9 Pro is compatible with C115, C210 and C245 soldering iron handle systems. The included package comes with a C210 handle. Package Includes 1 × AIFEN A9 Pro Soldering Station 1 × C210 Handle 1 × C210 Straight Soldering Ti..

AiXun H314 1400W Intelligent Digital High-Power Hot Air Gun Desoldering Rework Station A high-power intelligent hot air rework station designed for controlled heating, desoldering and electronic repair work. The AiXun H314 is an intelligent digital hot air rework station equipped with a 1400W heating core and a 3.5-inch IPS display. It combines high-power heating with temperature and airflow control, multiple operating modes, memory channels, fingerprint-based account switching and Wi-Fi/Bluetooth connectivity. ``` According to AiXun's product specifications, the H314 can reach 380°C in approximately 3 seconds under Top Speed mode. It supports Soft, Standard and Top Speed modes, with a 9-channel design and storage for up to 45 quick memory channels across 5 user accounts. ``` Key Features ``` 1400W High-Power Heating The H314 uses a 1400W rated heating core for rapid heating and high-power hot air rework applications. Rapid Heating Under Top Speed mode, the heating temperature can reach 380°C in approximately 3 seconds. 3.5-Inch IPS Display The station features a 3.5-inch IPS display for operation and adjustment of the hot air system. Three Operating Modes Soft, Standard and Top Speed modes are available for different hot air rework requirements. Fingerprint User Management Built-in fingerprint recognition allows users to switch between up to 5 account groups and access their respective saved data. Memory Channels The H314 provides a 9-channel design and can save up to 45 quick memory channels. Wi-Fi & Bluetooth Connectivity Built-in Wi-Fi and Bluetooth connectivity supports device interconnection and OTA software updates. Segment & Curve Desoldering The H314 supports segmented and curve desoldering functions for controlled hot air rework processes. 3D Air Nozzle & Spring-Lock Design The air nozzle system uses a spring-lock design together with a 3D air nozzle and AiXun's temperature-control and ..

The AMAOE Middle Layer BGA Reballing Stencil is designed for motherboard middle-layer soldering work on the Samsung Galaxy S20 Ultra G988B/BR. It helps technicians align solder paste or solder balls with the corresponding pad pattern when repairing and reassembling the separated motherboard layers. Product Specifications Brand: AMAOE Product Type: Middle Layer BGA Reballing Stencil Thickness: 0.12mm Compatible Device: Samsung Galaxy S20 Ultra Model Compatibility: G988B / G988BR Application: Motherboard middle-layer soldering and rework Package Contents: 1 × Middle Layer Stencil Usage: Match the stencil pattern with the motherboard's middle-layer solder pad layout before starting rework. Confirm the board model and pattern compatibility before use...

The AMAOE Middle Layer BGA Reballing Stencil is designed for middle-layer motherboard repair on the Samsung Galaxy S20 Ultra G988U. It helps technicians reproduce the solder-pad pattern when reworking and reassembling separated motherboard layers. Specifications Brand: AMAOE Product Type: Middle Layer BGA Reballing Stencil Compatible Device: Samsung Galaxy S20 Ultra Model: G988U Thickness: 0.12mm Application: Motherboard middle-layer soldering and rework Package Contents: 1 × Stencil Usage: Align the stencil with the matching motherboard pad pattern before reballing. Confirm the board model and stencil pattern before starting repair work...

AMAOE 26×26mm 0.30mm Universal BGA Reballing Stencil The AMAOE Universal BGA Reballing Stencil measures 26×26mm and has a 0.30mm thickness with 1.27mm spacing. It is designed for universal BGA reballing applications. Brand AMAOE Size 26×26mm Thickness 0.30mm Spacing 1.27mm Type Universal BGA Reballing Stencil..

AMAOE 50×50mm 0.30mm Universal BGA Reballing Stencil The AMAOE Universal BGA Reballing Stencil measures 50×50mm and has a 0.30mm thickness with 1.0mm spacing. It is designed for universal BGA reballing applications. Brand AMAOE Size 50×50mm Thickness 0.30mm Spacing 1.0mm Type Universal BGA Reballing Stencil..

The AMAOE AU-4 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible Apple iPhone devices using A13 and A14 processors. Key Features Brand: AMAOE Model: AU-4 Thickness: 0.12mm Type: CPU BGA reballing stencil Supported CPU: Apple A13 and A14 Application: iPhone CPU reballing and motherboard repair Material: Japanese steel sheet, as listed by the seller The stencil helps technicians align solder balls or solder paste with the matching BGA layout during CPU rework. Compatibility Note: Confirm the CPU generation and stencil pattern before use to ensure compatibility with the motherboard being repaired...

The AMAOE AU1 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible Apple iPhone devices using A7, A8 and A9 processors. Its stencil pattern supports CPU and RAM reballing work for the corresponding chip layouts. Key Features Brand: AMAOE Model: AU1 Thickness: 0.12mm Type: CPU and RAM BGA reballing stencil Supported Processors: Apple A7, A8 and A9 Compatible Device Brand: Apple iPhone Material: Japanese steel sheet Application: CPU/RAM reballing and iPhone motherboard repair The stencil helps technicians align solder balls or solder paste with the matching BGA layout during chip rework. Compatibility Note: Confirm the processor generation and stencil pattern before use to ensure compatibility with the motherboard being repaired...

The AMAOE AU3 CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible Apple iPhone devices using A10, A11 or A12 processors. The AU3 stencil is listed for these Apple CPU generations by AMAOE. Key Features Brand: AMAOE Model: AU3 Type: CPU BGA reballing stencil Supported CPU Generations: Apple A10, A11 and A12 Compatible Device Brand: Apple iPhone Application: CPU reballing and motherboard repair The stencil helps technicians align solder balls or solder paste with the corresponding BGA layout during CPU rework. Compatibility Note: Confirm the CPU generation and stencil pattern before use to ensure compatibility with the motherboard being repaired...

AMAOE BGA316 0.15mm BGA Reballing Stencil The AMAOE BGA316 is a 0.15mm BGA reballing stencil designed for precise solder ball placement during chip-level BGA reballing and repair work. Brand AMAOE Model BGA316 Thickness 0.15mm Type BGA Reballing Stencil Package 1 × Stencil..

AMAOE DDR BGA178 BGA Reballing Stencil The AMAOE DDR BGA178 is a BGA reballing stencil designed for DDR BGA178 IC chip soldering and reballing work. It helps position solder balls during the reballing process. Brand AMAOE Model DDR BGA178 Application DDR BGA178 IC reballing Type BGA Reballing Stencil..

AMAOE DDR BGA78 BGA Reballing Stencil The AMAOE DDR BGA78 is a BGA reballing stencil designed for DDR BGA78 IC chip reballing and soldering work. It helps position solder balls during the reballing process. Brand AMAOE Model DDR BGA78 Application DDR BGA78 IC reballing Type BGA Reballing Stencil..

The AMAOE EU-3 0.12mm CPU BGA Reballing Stencil is designed for Samsung Exynos processor and RAM reballing during mobile motherboard repair. It supports multiple Exynos IC layouts, making it suitable for technicians working on compatible Samsung devices. Key Features Brand: AMAOE Model: EU-3 Thickness: 0.12mm Material: Japanese steel sheet Type: CPU and RAM BGA reballing stencil Supported ICs: Exynos 7885 CPU/RAM, Exynos 9820, Exynos 9610 CPU/RAM, Exynos 990 CPU/RAM and Exynos 980 Application: IC reballing and Samsung motherboard repair The stencil helps align solder balls or solder paste with the matching BGA pad pattern during IC rework. Compatibility Note: Verify the IC model and stencil layout before use to ensure the correct pattern is selected...

The AMAOE EU-4 0.12mm Exynos IC BGA Reballing Stencil is designed for BGA reballing and motherboard repair on compatible Samsung devices using the matching Exynos IC layout. Key Features Brand: AMAOE Model: EU-4 Thickness: 0.12mm Type: Exynos IC BGA reballing stencil Compatible Brand: Samsung Application: IC reballing and mobile motherboard repair The stencil helps technicians align solder balls or solder paste with the corresponding BGA pad layout during chip rework. Compatibility Note: Confirm the IC marking and stencil pattern before use to ensure compatibility with the Samsung motherboard being repaired...

AMAOE G977-010 is a 0.10mm middle-layer BGA reballing stencil designed for the Samsung Galaxy S10 5G G977 series motherboard. It is used to recreate the solder points on the intermediate layer of the layered motherboard during board separation, repair and reassembly. Model: G977-010 Thickness: 0.10mm Compatible Device: Samsung Galaxy S10 5G Compatible Board Series: G977 Compatible Variants: G977U / G977R / G977T / G977P Product Type: Middle Layer BGA Reballing Stencil Application: Motherboard middle-layer solder point rework and reassembly Size: 70 × 70mm Package: 1 × Stencil This stencil is for the middle-layer motherboard soldering process and is not a CPU or individual IC reballing stencil...

AMAOE M14/M15 Solder Paste is a solder paste for mobile phone motherboard, PCB, BGA, CPU and IC repair. It is designed for soldering and rework of electronic components where controlled application of solder paste is required. The product is available in two temperature options: M14 at 183°C and M15 at 138°C. Both variants are supplied in 20g packaging, allowing the required solder paste to be selected according to the repair application and working temperature. Brand AMAOE Models M14 / M15 Type Solder Paste Net Weight 20g M14 183°C, Sn63/Pb37 M15 138°C, Sn42/Bi58 Applications Mobile Phone, PCB, BGA, CPU & IC Repair Choose the required variant from the Temperature option: 138°C (M15) or 183°C (M14)...

AMAOE M50 is a halogen-free solder flux paste supplied in a 10CC syringe. It is designed for electronics soldering and repair work, including mobile phone and laptop motherboards, CPU and IC soldering, SMD components and BGA rework. The paste flux helps improve solder wetting and flow during soldering and rework. Its syringe format allows the flux to be applied directly and accurately to the required repair area. Package includes: 1 × AMAOE M50 10CC solder flux syringe and 2 × dispensing needles...

AMAOE M53 is a no-clean soldering flux paste designed for electronics soldering and repair work. It helps improve solder flow and wetting during component soldering and rework. The M53 flux is supplied in a 10CC syringe for controlled application. It is suitable for mobile phone and laptop motherboard repair, PCB and IC soldering, CPU, LED, SMD and BGA rework applications. Available product information describes it as a no-clean flux with minimal residue and good insulation resistance. Brand AMAOE Model M53 Type No-Clean Soldering Flux Paste Capacity 10CC Application PCB, IC, Mobile Phone, CPU, LED, SMD & BGA Repair Flux Type No-Clean Its syringe format allows precise placement of flux on small soldering areas, making it suitable for microsoldering, motherboard repair and BGA rework.  ..

AMAOE MI10 is a 0.12mm BGA reballing stencil designed for CPU, RAM and compatible BGA IC reballing on Xiaomi and Redmi smartphone motherboards. It is associated with the Qualcomm SM7150 and SM8150 platforms and is suitable for precision solder-ball placement during IC repair. The stencil is suitable for applications involving Redmi K20, Redmi K20 Pro and Xiaomi Mi 9, with compatibility based on the corresponding SM7150/SM8150 chipset and IC pattern. It can also be used for compatible Qualcomm platform ICs such as PM7150 and PM8150 series components, depending on the stencil pattern. Brand AMAOE Model MI10 / MI-10 Stencil Thickness 0.12mm Type BGA Reballing Stencil Platform Qualcomm SM7150 / SM8150 Compatible Devices Redmi K20, Redmi K20 Pro, Xiaomi Mi 9 Applications CPU, RAM & BGA IC Reballing Package 1 × AMAOE MI10 BGA Stencil The 0.12mm stencil provides the required pad pattern for reballing work and is intended for professional mobile motherboard and micro-soldering applications...

AMAOE MI11 is a 0.12mm BGA reballing stencil designed for CPU, RAM and other BGA IC reballing work on Xiaomi and Redmi motherboards. It provides the required solder-ball pattern for precise IC reballing and motherboard repair. The MI11 stencil supports multiple IC patterns including SM6125, SDM710, MT6785V and other compatible components. It is associated with Xiaomi CC9, CC9e, Mi 8 SE, Mi A3 and Redmi Note 8 series devices. Compatibility should be matched according to the IC or processor code before use. Brand AMAOE Model MI11 / MI-11 Thickness 0.12mm Type BGA Reballing Stencil IC / CPU Support SM6125, SDM710, MT6785V and compatible IC patterns Compatible Devices Xiaomi CC9, CC9e, Mi 8 SE, Mi A3, Redmi Note 8 and compatible models Application CPU, RAM & BGA IC Reballing Package 1 × Stencil The 0.12mm stencil is intended for professional mobile motherboard repair, IC reballing and microsoldering applications...

AMAOE MI12 is a 0.12mm BGA reballing stencil designed for Snapdragon 865 (SM8250) CPU reballing and motherboard repair. It is suitable for compatible Xiaomi and Redmi devices, including Xiaomi Mi 10, Mi 10 Pro and Redmi K30 Pro. The stencil provides a precise solder-ball pattern for reballing compatible CPU chips during mobile motherboard repair. Its 0.12mm thickness is intended for professional BGA rework and microsoldering applications. Brand AMAOE Model MI12 Thickness 0.12mm Type CPU BGA Reballing Stencil CPU Qualcomm Snapdragon 865 (SM8250) Compatible Devices Xiaomi Mi 10, Xiaomi Mi 10 Pro, Redmi K30 Pro Application CPU BGA Reballing and Mobile Motherboard Repair Package 1 × Stencil..

AMAOE MI13 is a 0.12mm multi-IC BGA reballing stencil designed for compatible CPU and IC reballing applications. It supports MediaTek MT6769V and Qualcomm SM6115 / SM7225 platforms and is used for motherboard repair and BGA IC reballing. Model: MI13 Thickness: 0.12mm Main CPU Platforms: MT6769V / SM6115 / SM7225 Chipsets: MediaTek MT6769V, Snapdragon 662, Snapdragon 750G BGA Pattern: BGA254 Compatible Devices: Redmi 9, Redmi Note 9, Redmi Note 9 4G, Redmi Note 9 Pro 5G and other compatible devices using the supported CPU platforms Application: CPU and BGA IC Reballing Material: Japanese Steel Sheet Hole Type: Square Reusable: Yes Package: 1 × Stencil..