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AMAOE DDR BGA178 BGA Reballing Stencil The AMAOE DDR BGA178 is a BGA reballing stencil designed for DDR BGA178 IC chip soldering and reballing work. It helps position solder balls during the reballing process. Brand AMAOE Model DDR BGA178 Application DDR BGA178 IC reballing Type BGA Reballing Stencil..

AMAOE DDR BGA78 BGA Reballing Stencil The AMAOE DDR BGA78 is a BGA reballing stencil designed for DDR BGA78 IC chip reballing and soldering work. It helps position solder balls during the reballing process. Brand AMAOE Model DDR BGA78 Application DDR BGA78 IC reballing Type BGA Reballing Stencil..

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AMAOE LPDDR-1 is a 0.15mm BGA reballing stencil designed for LPDDR and compatible memory IC reballing work. It provides accurately cut apertures for controlled solder paste or solder ball application during IC rework. The stencil supports multiple BGA package layouts, including BGA60, BGA134, BGA136, BGA168, BGA178 and BGA200, making it suitable for different LPDDR and memory IC repair applications. Brand AMAOE Model LPDDR-1 Thickness 0.15mm Type LPDDR Memory BGA Reballing Stencil Supported BGA BGA60, BGA134, BGA136, BGA168, BGA178 & BGA200 Package 1 × Stencil..