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AMAOE 0.12mm BGA Reballing Stencil for Dimensity 8100 Max MT6895Z Lower Layer Model-specific lower-layer BGA reballing stencil for MediaTek Dimensity 8100 Max MT6895Z. The AMAOE 0.12mm BGA Reballing Stencil is designed for MediaTek Dimensity 8100 Max (MT6895Z) lower-layer reballing applications. It is intended for IC and motherboard repair work where reballing of the corresponding BGA package is required. Product Features MT6895Z Compatible – Designed for the MediaTek Dimensity 8100 Max. Lower Layer Stencil – Intended specifically for lower-layer BGA reballing work. 0.12mm Thickness – Product thickness specified for this stencil. BGA Reballing – Suitable for professional IC and motherboard repair applications. Compatibility Compatible Chip: MediaTek Dimensity 8100 Max (MT6895Z) Application: Lower Layer BGA Reballing Specifications Brand AMAOE Model MT6895Z Compatible Chip Dimensity 8100 Max Type BGA Reballing Stencil Application Lower Layer Thickness 0.12mm Package Includes 1 × AMAOE MT6895Z BGA Reballing Stencil..

AMAOE MI16 is a 0.12mm CPU BGA reballing stencil designed for MediaTek Dimensity 8100 and Dimensity 9000 processor platforms. It supports MT6895Z and MT6983Z CPU layouts and is suitable for CPU, RAM and supporting IC reballing during Xiaomi and Redmi motherboard repair. Model: MI16 Thickness: 0.12mm CPU Platforms: MediaTek Dimensity 8100 / Dimensity 9000 Chip Codes: MT6895Z / MT6983Z Compatible Devices: Redmi K50, Redmi K50 Pro, Redmi Note 11 Pro, Redmi Note 11 Pro+, Xiaomi 12 Pro Dimensity Edition Supported Patterns: CPU, RAM, BGA153 and multiple supporting IC layouts Application: CPU, RAM and BGA IC Reballing Package: 1 × Stencil The stencil is designed to match the BGA pad layout of the supported processor and memory packages for accurate solder-ball placement during reballing work...

AMAOE MT6835V 0.12mm CPU BGA Reballing Stencil The AMAOE MT6835V is a 0.12mm CPU BGA reballing stencil designed for the MediaTek Dimensity 6100+ processor. It is suitable for CPU reballing and chip-level motherboard repair. The stencil provides the required aperture pattern for MT6835V CPU reballing and accurate solder ball placement. Brand AMAOE Model MT6835V Compatible CPU MediaTek Dimensity 6100+ (MT6835V) Thickness 0.12mm Type CPU BGA Reballing Stencil Package 1 × Stencil..

AMAOE MT6879V 0.12mm CPU BGA Reballing Stencil The AMAOE MT6879V is a 0.12mm CPU BGA reballing stencil designed for the MediaTek Dimensity 1050 chipset. It is used for accurate solder ball placement during CPU reballing and mobile motherboard repair. The stencil provides the dedicated MT6879V CPU BGA pattern, helping technicians align the solder balls correctly on the chip during the reballing process. Product Details Brand AMAOE Model MT6879V Chipset MediaTek Dimensity 1050 (MT6879V) Stencil Type CPU BGA Reballing Thickness 0.12mm Application CPU BGA Reballing & Mobile Motherboard Repair..

AMAOE MT6885Z / MT6889Z 0.12mm Lower Layer BGA Reballing Stencil The AMAOE MT6885Z / MT6889Z is a 0.12mm lower layer BGA reballing stencil for MediaTek Dimensity 1000 / L chip reballing and motherboard repair work. It is designed for accurate solder ball placement on the lower layer of the compatible IC during the BGA reballing process. Product Details Brand AMAOE Model MT6885Z / MT6889Z Compatible Designation Dimensity 1000 / L Type Lower Layer BGA Reballing Stencil Thickness 0.12mm Package 1 × Stencil..

AMAOE MT6886V 0.12mm CPU BGA Reballing Stencil The AMAOE MT6886V is a 0.12mm CPU BGA reballing stencil designed for the MediaTek Dimensity 7200 Ultra processor. It is suitable for CPU reballing and chip-level motherboard repair. The stencil provides the required aperture pattern for MT6886V CPU reballing and accurate solder ball placement. Brand AMAOE Model MT6886V Compatible CPU MediaTek Dimensity 7200 Ultra (MT6886V) Thickness 0.12mm Type CPU BGA Reballing Stencil Package 1 × Stencil..

AMAOE MT6983Z-9000 0.12mm CPU BGA Reballing Stencil The AMAOE MT6983Z-9000 is a 0.12mm CPU BGA reballing stencil designed for the MediaTek Dimensity 9000 5G chipset. It is used for accurate solder ball placement during CPU reballing and mobile motherboard repair. Product Details Brand AMAOE Model MT6983Z-9000 Chipset MediaTek Dimensity 9000 5G (MT6983Z) Stencil Type CPU BGA Reballing Thickness 0.12mm Application CPU BGA Reballing & Motherboard Repair..