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AMAOE E8535P 0.12mm CPU BGA Reballing Stencil The AMAOE E8535P is a 0.12mm CPU BGA reballing stencil designed for the Samsung Exynos 1350 processor. It is suitable for CPU reballing and chip-level motherboard repair. The stencil provides the required aperture pattern for E8535P CPU reballing and solder ball placement. Brand AMAOE Model E8535P Compatible CPU Samsung Exynos 1350 (E8535P) Thickness 0.12mm Type CPU BGA Reballing Stencil Package 1 × Stencil..