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AMAOE MT6879V 0.12mm CPU BGA Reballing Stencil The AMAOE MT6879V is a 0.12mm CPU BGA reballing stencil designed for the MediaTek Dimensity 1050 chipset. It is used for accurate solder ball placement during CPU reballing and mobile motherboard repair. The stencil provides the dedicated MT6879V CPU BGA pattern, helping technicians align the solder balls correctly on the chip during the reballing process. Product Details Brand AMAOE Model MT6879V Chipset MediaTek Dimensity 1050 (MT6879V) Stencil Type CPU BGA Reballing Thickness 0.12mm Application CPU BGA Reballing & Mobile Motherboard Repair..