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AMAOE MT6983Z-9000 0.12mm CPU BGA Reballing Stencil The AMAOE MT6983Z-9000 is a 0.12mm CPU BGA reballing stencil designed for the MediaTek Dimensity 9000 5G chipset. It is used for accurate solder ball placement during CPU reballing and mobile motherboard repair. Product Details Brand AMAOE Model MT6983Z-9000 Chipset MediaTek Dimensity 9000 5G (MT6983Z) Stencil Type CPU BGA Reballing Thickness 0.12mm Application CPU BGA Reballing & Motherboard Repair..