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The AMAOE MT-1 MediaTek Power IC Reballing Stencil is designed for mobile phone motherboard repair and power IC reballing. It helps technicians position solder balls according to the compatible IC's BGA layout during chip-level repair. Key Features Designed for MediaTek power IC BGA reballing. Suitable for compatible IC rework and motherboard repair. Helps maintain accurate solder-ball placement. Useful for mobile repair technicians and electronics workshops. Compatible IC Models MT6311P MT6158A MT6165V MT6350V MT6329A MT6320 MT6175V MT6328V MT6351V Product Specifications Brand: AMAOE Model: MT-1 Product Type: MediaTek Power IC BGA Reballing Stencil Application: Mobile motherboard repair and IC reballing Usage Note: Check the IC marking and stencil hole pattern before starting reballing to ensure compatibility. Stencil thickness and package contents should be confirmed with the supplier...

AMAOE MT8781 0.12mm CPU BGA Reballing Stencil The AMAOE MT8781 is a dedicated 0.12mm CPU BGA reballing stencil for the MediaTek MT8781 processor. It is designed for CPU reballing and chip-level motherboard repair work. The stencil provides an aperture pattern matched to the MT8781 CPU for accurate solder ball placement during the reballing process. Product Details Brand AMAOE Model MT8781 Compatible CPU MediaTek MT8781 Type CPU BGA Reballing Stencil Thickness 0.12mm Package 1 × Stencil..