Search
Bend Angle Hot Air Nozzle for QUICK 850 / 857DW+ Series
Bend Angle Hot Air Nozzle The Bend Angle Hot Air Nozzle is designed for compatible QUICK 850 and 857DW+ series hot air rework stations. Its angled outlet helps direct hot airflow toward specific components and PCB areas, making it useful for precision electronics repair work. This nozzle is suitable for SMD rework, IC soldering and desoldering, and mobile motherboard repair. Its bent design can help technicians direct airflow into areas where a straight nozzle may be difficult to position. Key Features Angled Design: Helps direct hot airflow toward the required working area. Series Compatibility: Designed for compatible QUICK 850 and 857DW+ series hot air stations. Precision Airflow: Useful for targeted heating during electronics repair. Repair Applications: Suitable for SMD rework, IC removal and PCB repair. Compatibility QUICK 850 Series QUICK 857DW+ Series Note: Please select the required nozzle size from the available options and confirm compatibility with your hot air gun before ordering...
QUICK 861DW Compatible Angled Hot Air Nozzle for Precision SMD Repair β 6mm 8mm 10mm 12mm
Angled Hot Air Nozzle for QUICK 861DW Upgrade your hot air rework setup with an Angled Hot Air Gun Nozzle, designed for targeted airflow during mobile phone motherboard repair and electronic component rework. Its angled outlet helps direct hot air towards the required working area, making it useful for precision SMD soldering, desoldering and IC replacement tasks. Designed for compatible QUICK 861DW hot air guns, this nozzle is available in four different sizes to suit various repair requirements. Available Sizes 6mm: Smaller outlet for focused hot air application. 8mm: Suitable for precision component rework. 10mm: Medium-size outlet for different repair tasks. 12mm: Larger outlet for broader airflow coverage. Key Features Angled design for directed hot air application. Compatible with supported QUICK 861DW hot air guns. Four nozzle diameter options. Useful for SMD soldering and desoldering. Suitable for smartphone motherboard and PCB repair. Applications Suitable for IC removal, SMD component replacement, PCB rework, mobile motherboard repair and general electronics soldering work. Compatibility: QUICK 861DW hot air gun. Confirm nozzle fitting before ordering. Available Options: 6mm, 8mm, 10mm and 12mm. Select the required size before purchase...
