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AMAOE 1+10P 0.12mm Middle Layer BGA Reballing Stencil for OnePlus 10 Pro Model-specific middle layer BGA reballing stencil designed for OnePlus 10 Pro motherboard repair. The AMAOE 1+10P Middle Layer BGA Reballing Stencil is specifically designed for the OnePlus 10 Pro. It is used for middle-layer BGA reballing work during motherboard and IC repair. The stencil has a 0.12mm thickness and a 70 × 70mm size, making it suitable for the corresponding OnePlus 10 Pro middle-layer reballing application. Key Features OnePlus 10 Pro Compatible – Designed specifically for OnePlus 10 Pro motherboard repair. Middle Layer BGA Reballing – Suitable for middle-layer BGA reballing applications. 0.12mm Thickness – Model-specific stencil thickness. 70 × 70mm Size – Size specified for the 1+10P version. AMAOE 1+10P – Model-specific reballing stencil. Compatibility Compatible Model: OnePlus 10 Pro This 1+10P stencil is intended for the OnePlus 10 Pro. Please make sure the model matches your repair requirement before ordering. Specifications Brand AMAOE Model 1+10P Type Middle Layer BGA Reballing Stencil Compatible Model OnePlus 10 Pro Thickness 0.12mm Size 70 × 70mm Package Includes 1 × AMAOE 1+10P Middle Layer BGA Reballing Stencil..

AMAOE 1+11 0.12mm Middle Layer BGA Reballing Stencil The AMAOE 1+11 is a 0.12mm middle layer BGA reballing stencil designed for the OnePlus 11. It is used for middle-layer reballing work during motherboard and IC repair. The stencil provides the required hole pattern for solder ball placement on the middle layer, making it suitable for BGA reballing work. Brand AMAOE Model 1+11 Compatible Device OnePlus 11 Thickness 0.12mm Type Middle Layer BGA Reballing Stencil Size 70 × 70mm..

AMAOE 1+9 Pro Middle Layer BGA Reballing Stencil The AMAOE 1+9 Pro is a middle-layer BGA reballing stencil designed for motherboard repair on the OnePlus 9 Pro. It is used by mobile repair technicians during solder-ball rework on compatible motherboard middle-layer layouts. Product Features Designed for OnePlus 9 Pro middle-layer motherboard reballing. Helps position solder balls for compatible BGA pad layouts. Suitable for professional mobile phone motherboard repair work. Compatibility OnePlus 9 Pro (1+9 Pro) Note: Confirm the motherboard layout and stencil alignment before use...