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2uul TW32 Black K Flat Tip ESD-Safe Ceramic Tweezers   Features: Ceramic Tweezer, Insulation-free  Precise penetration into the gap, fast removal of adhesive border Package includes: 1 x Tweezers..

AMAOE 0.12mm BGA Reballing Stencil for A1707 Hard Disk Master IC The AMAOE A1707 is a 0.12mm BGA reballing stencil designed for A1707 Hard Disk Master IC repair work. It is available in two different stencil options: CPU and RAM. Choose the required Stencil Type — CPU or RAM — according to the IC you need to reball. Each option is a dedicated stencil pattern for its respective IC. Available Stencil Types ``` CPU: A1707 CPU BGA reballing stencil RAM: A1707 RAM BGA reballing stencil Product Details ``` Brand AMAOE Model A1707 Stencil Type CPU / RAM Thickness 0.12mm Application BGA Reballing & IC Repair Select the correct option before ordering: Choose CPU for the CPU stencil or RAM for the RAM stencil...

AMAOE 337S00175 0.12mm BGA Reballing Stencil for Notebook CPU & RAM The AMAOE 337S00175 is a 0.12mm BGA reballing stencil designed for notebook board repair. It is available in two dedicated stencil types: CPU and RAM. Select the required Stencil Type before placing your order. Choose CPU for the CPU stencil or RAM for the RAM stencil. Each option has its own dedicated BGA pattern for the respective IC. Available Options CPU: 337S00175 CPU BGA reballing stencil RAM: 337S00175 RAM BGA reballing stencil Product Details Brand AMAOE Model 337S00175 Stencil Type CPU / RAM Thickness 0.12mm Application BGA Reballing & Notebook Board Repair Select the correct Stencil Type before ordering: Choose CPU or RAM according to the IC you need to reball...

AMAOE A17 RAM 0.12mm Upper Layer BGA Reballing Stencil The AMAOE A17 RAM is a 0.12mm upper layer BGA reballing stencil designed for Apple A17 RAM reballing work. It is suitable for chip-level motherboard repair and RAM reballing. The stencil provides the required aperture pattern for solder ball placement on the A17 RAM upper layer during BGA reballing. Brand AMAOE Model A17 RAM Compatible IC Apple A17 RAM Thickness 0.12mm Type Upper Layer BGA Reballing Stencil Package 1 × Stencil..

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AMAOE U-MTK7 BGA Reballing Stencil The AMAOE U-MTK7 is a multi-pattern BGA reballing stencil for mobile motherboard repair. It is designed for compatible MediaTek CPUs and supporting ICs. Supported IC Models CPU: MT6895Z, MT6983Z, MT6785V Other ICs: MT6637XP, MT6190MV, 58080-11, 77048E, MT6186MV, MT6319AP, 53730-11, SC8551A Additional listed patterns: RAM496, MT6359VKP, MT6375P, MT6360P, 77912-61 Note: Verify the exact IC marking and stencil pattern before use...

AMAOE U-QSD1 Qualcomm CPU & RAM BGA Reballing Stencil The AMAOE U-QSD1 is a Qualcomm BGA reballing stencil designed for mobile phone motherboard repair. It supports selected Snapdragon processor and RAM layouts, helping technicians perform accurate solder-ball rework during chip-level repairs. Supported IC Models MSM8976 / MSM8956 CPU and RAM MSM8992 CPU and RAM MSM8974 / MSM8274 / MSM8674 CPU Specifications: 0.12 mm thickness, according to specialist listings. Note: CPU and RAM may require different stencil patterns. Verify the exact IC layout before use...

AMAOE U-QSD10 Qualcomm CPU & RAM BGA Reballing Stencil The AMAOE U-QSD10 is a multi-pattern BGA reballing stencil designed for Qualcomm Snapdragon motherboard repair. It supports selected CPU, RAM and related IC layouts for chip-level mobile phone repairs. Supported IC Models CPU: SM8350, SM8450, SM8475, SM8425, SM7475 RAM: RAM496 Other ICs: SMB1396, PM8350BH-001, PM8450, PM8350C, SDR735, VC7643, SC8571, QMP5679, WCD9380, WCD9385, QDM3302, QPA5590, QET7100 Specifications: 0.12 mm thickness. Stainless steel stencil with square-pattern openings. Note: Confirm the exact IC marking and matching stencil layout before use...

AMAOE U-QSD2 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil The AMAOE U-QSD2 is a multi-pattern BGA reballing stencil for mobile motherboard repair. It is designed for selected Qualcomm Snapdragon CPUs, RAM chips and BGA153 ICs, helping technicians restore solder ball patterns during chip-level repairs. Supported IC Models CPU: MSM8998 (Snapdragon 835), MSM8996 (Snapdragon 820/821) RAM: MSM8998 RAM, MSM8996 RAM Other pattern: BGA153 Specifications: Model U-QSD2, 0.12 mm thickness, reusable steel stencil. Note: Check the IC marking and matching stencil pattern before use...

AMAOE U-QSD4 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil The AMAOE U-QSD4 is a multi-pattern BGA reballing stencil for mobile motherboard repair. It is designed for selected Qualcomm Snapdragon CPUs and supporting ICs, helping technicians restore solder ball patterns during chip-level repairs. Supported IC Models CPU: MSM8953, MSM8937, MSM8940, MSM8917, SDM632, SDM450 Power ICs: PM8937, PM8940, PMI8940, PMI8942, PM8953, PMI632 Other ICs: WTR2965, WCN3615, RF5428, RF5212A, 56020, BGA153, BGA178, BGA221 Specifications: Model U-QSD4, 0.12 mm thickness. Note: Verify the IC marking and stencil pattern before use...

AMAOE U-QSD5 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil The AMAOE U-QSD5 is a multi-pattern BGA reballing stencil designed for Qualcomm Snapdragon CPU and RAM chip repair. It helps mobile repair technicians restore solder ball patterns during motherboard-level servicing. Supported IC Models CPU: SM6125, SM6150, SDM636, SDM660, SDM670, SDM710 Other ICs: WCN3980, WCN3990, WCD9370, DA9313, PM670A, PM670, SDR660, PM6150, PM6150L, PMI632, BGA254, 56020, 7210M-11, PM1632, 77920-21 Specifications: Model U-QSD5, 0.12 mm thickness, stainless steel stencil with square-pattern openings. Note: Confirm the IC marking and stencil pattern before use...

AMAOE U-QSD6 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil The AMAOE U-QSD6 is a multi-pattern BGA reballing stencil designed for Qualcomm Snapdragon motherboard repair. It supports selected CPU, RAM and related IC layouts for chip-level mobile phone servicing. Supported IC Models CPU: SM8150, SM7150, SDM845 RAM: RAM556 Power ICs: PM8150, PM8150A, PM8150B, PM7150, PM7150A, PM845, PMI8998 Other ICs: DA9313, SMB1390, WCN3990, WCD9340, SDR8150, SDR660, QM57016, BGA153, BGA254 Specifications: Model U-QSD6, 0.12 mm thickness. Note: Confirm the IC marking and matching stencil pattern before use...

AMAOE U-QSD9 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil The AMAOE U-QSD9 is a multi-pattern BGA reballing stencil designed for Qualcomm Snapdragon motherboard repair. It supports CPU, RAM and related IC layouts used in chip-level mobile phone servicing. Supported IC Models CPU: SM8250 (Snapdragon 865), SM8250-002 (Snapdragon 870) RAM: RAM496, RAM556 Power ICs: PM8150A, PM8150B, PM8250 Other ICs: QCA6391, QPM5679, SDX865, SDX55M, DA9313, PMX55, PMW5100, WCD9385, 78190-31, 77040, BGA153 Specifications: Model U-QSD9, 0.12 mm thickness. Note: Check the IC marking and matching stencil pattern before use...

AMAOE U-SMG1 Samsung Exynos CPU & RAM BGA Reballing Stencil The AMAOE U-SMG1 is a multi-pattern BGA reballing stencil designed for Samsung Exynos chip repair. It helps technicians restore solder ball patterns on compatible CPUs, RAM and related ICs during mobile motherboard repairs. Supported IC Models CPU: Exynos 8895, Exynos 7570, Exynos 7580, Exynos 3475 Related ICs: MAX778655, QM78038, SHANNON955, BGA221, BGA153, 4015B1, AFEM-9060, VJ51D, 77759-51, 605HP5, CS47L93 RAM: Exynos 8895 RAM Specifications: Model U-SMG1, 0.12 mm thickness. Note: Confirm the chip marking and matching stencil pattern before use...

AMAOE U-SMG2 Samsung Exynos CPU & RAM BGA Reballing Stencil The AMAOE U-SMG2 is a multi-pattern BGA reballing stencil designed for Samsung Exynos chip repair. It helps technicians restore solder ball patterns on compatible CPUs, RAM and supporting ICs during mobile motherboard repairs. Supported IC Models CPU: Exynos 9610, 9611, 7904, 7885, 7884, 7880, 7870 RAM: Exynos 9610/9611 RAM, Exynos 7884/7885/7904 RAM, Exynos 7870/7880 RAM Power ICs: S2MU004X, S2MU005X03, SM5713, S915, S515, S527S Other ICs: BCM43456HKUBG, SHANNON937, D5328/TFBMA, 77656-11, MU106X01-5, BGA153 Specifications: Model U-SMG2, 0.12 mm thickness, stainless steel stencil. Note: Check the IC marking and matching stencil pattern before use...

AMAOE U-SMG3 Samsung Exynos CPU & RAM BGA Reballing Stencil The AMAOE U-SMG3 is a multi-pattern BGA reballing stencil designed for Samsung Exynos motherboard repair. It helps technicians restore solder ball patterns on compatible CPUs and RAM during chip-level mobile phone repairs. Supported IC Models CPU: Exynos 9810, Exynos 9820, Exynos 850, Exynos 3830 RAM: RAM556 Application: CPU and RAM reballing for compatible Samsung Exynos boards Specifications: Model U-SMG3, 0.12 mm thickness, stainless steel stencil. Note: Confirm the IC marking and stencil pattern before use. Individual PA and power IC patterns are not specified in the verified compatibility list...

AMAOE U-SMG4 Samsung Exynos CPU & RAM BGA Reballing Stencil The AMAOE U-SMG4 is a multi-pattern BGA reballing stencil designed for Samsung Exynos motherboard repair. It helps technicians restore solder ball patterns on compatible CPUs, RAM and supporting ICs during chip-level repairs. Supported IC Models CPU: Exynos 880, Exynos 980, Exynos 1080, Exynos 1280, E8825 RAM: RAM556, E8825 RAM Related ICs: SPU13P, SPU14P, 77098B, 77040, 77032, QPA5580, QPA4580, QFM3576, SM5714, SHANNON5511, SHANNON5510, S6565, 78201, 8267-11, 58083-11, S2MU106X01, S3700, BGA153, BGA254 Specifications: Model U-SMG4, 0.12 mm thickness, reusable stainless steel stencil. Note: Verify the IC marking and matching stencil pattern before use...