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2UUL BH11 Universal Phone Board Mid Frame Reballing Magnetic Platform ✅ Main Features Strong built-in magnetic adsorption automatically holds the motherboard and stencil firmly in position. Designed for middle-layer reballing, BGA rework, CPU, IC and chip tin planting applications. Two platform groove depths (1mm and 2mm) support different motherboard and chip thicknesses. High-temperature resistant construction allows direct hot air gun operation during repair. Ensures precise alignment between stencil and pad for more uniform solder balls. Helps prevent stencil bulging and improves stencil service life. Compatible with both iPhone and Android motherboard repair applications. 🔧 Suitable Applications Phone motherboard middle layer reballing CPU and IC chip tin planting BGA rework and soldering Micro-soldering repair work PCB positioning and fixing iPhone and Android board maintenance 📋 Specifications Brand: 2UUL Model: BH11 Type: Universal Magnetic Reballing Platform Groove Depth: 1mm & 2mm Heat Resistance: Yes Compatibility: Universal 📦 Package Includes 1 × 2UUL BH11 Universal Magnetic Platform 2 × Tin Scrapers / Blades Video Download Link: https://vimeo.com/2uul/download/766033574/719b724080..

2UUL BH17 CPU Reball Base Magnetic Dual Sided BGA Reballing Platform Set for iPhone / Android Key Specifications & Components Model: BH17 (Cpureball Base). Structure: CNC-machined aluminum alloy body with a dual-sided magnetic frame for maximum stability. Included Stencils: Typically comes with 75 precision CPU stencils covering a wide range of chipsets. Stencil Thickness: Includes options for 0.12mm (some kits specify T0.6 for Apple and T0.35 for Android) to handle various reballing requirements. Dimensions: Platform size is approximately 58 × 58 × 11 mm with a net weight of 238g.  Features and Benefits Magnetic Locking: Features a powerful dual-sided magnetic system that holds both the CPU and the stencil firmly in place, preventing shifting during heating. High Compatibility: Supports a broad spectrum of mobile processors, including Apple A-series (A10 to A19), Qualcomm Snapdragon (up to SM8750/Snapdragon 8 Ultra), MediaTek (MTK), and Samsung Exynos. Efficiency: The dual-sided design allows technicians to switch between different chip types quickly without losing alignment, increasing workflow throughput. Thermal Contact: Engineered for improved thermal contact and heat resistance, ensuring the platform does not warp or lose magnetic strength during hot-air reflow.  Usage Tips Preparation: Always place the platform on a flat, stable work surface. Alignment: Carefully align the CPU and the magnetic stencil before applying heat to ensure even solder ball distribution. Heat Management: Avoid excessive hot air pressure which can cause "stencil lift." Do not overheat the base excessively to preserve the life of the internal magnets. Maintenance: Clean stencils thoroughly after each use with a suitable solvent (like Relife RL-055 dispenser bottle) to maintain aperture accurac..

AMAOE 0.10mm Magnetic BGA Reballing Stencil for MacBook A1707-T1-343S00136 Model-specific BGA reballing stencil designed for MacBook A1707-T1-343S00136. The AMAOE 0.10mm Magnetic BGA Reballing Stencil is designed specifically for the MacBook A1707-T1-343S00136 and is intended for BGA reballing work during motherboard repair. Product Features Designed for MacBook A1707-T1-343S00136 Suitable for BGA reballing applications 0.10mm stencil thickness Magnetic stencil design Compatibility Compatible Model: MacBook A1707-T1-343S00136 Specifications Brand AMAOE Model A1707-T1-343S00136 Type Magnetic BGA Reballing Stencil Compatible Model MacBook A1707-T1-343S00136 Thickness 0.10mm..

AMAOE 0.12mm 339S00912 WiFi BGA Reballing Stencil for Apple MacBook Pro 2021 Model-specific WiFi BGA reballing stencil for Apple MacBook Pro 2021 motherboard repair. The AMAOE 339S00912 WiFi BGA Reballing Stencil is designed for the WiFi module used in Apple MacBook Pro 2021. It is intended for BGA reballing work during motherboard and WiFi module repair. Product Features 339S00912 WiFi Stencil – Designed for the 339S00912 WiFi module. MacBook Pro 2021 Compatible – Intended for the corresponding WiFi module application in Apple MacBook Pro 2021. 0.12mm Thickness – Product thickness specified for this stencil. BGA Reballing – Suitable for WiFi module BGA reballing and motherboard repair work. Compatibility Compatible Device: Apple MacBook Pro 2021 WiFi Module: 339S00912 Specifications Brand AMAOE Model 339S00912 Type WiFi BGA Reballing Stencil Compatible Device Apple MacBook Pro 2021 Thickness 0.12mm Package Includes 1 × AMAOE 339S00912 WiFi BGA Reballing Stencil..

AMAOE 0.12mm BGA Reballing Stencil for Dimensity 8100 Max MT6895Z Lower Layer Model-specific lower-layer BGA reballing stencil for MediaTek Dimensity 8100 Max MT6895Z. The AMAOE 0.12mm BGA Reballing Stencil is designed for MediaTek Dimensity 8100 Max (MT6895Z) lower-layer reballing applications. It is intended for IC and motherboard repair work where reballing of the corresponding BGA package is required. Product Features MT6895Z Compatible – Designed for the MediaTek Dimensity 8100 Max. Lower Layer Stencil – Intended specifically for lower-layer BGA reballing work. 0.12mm Thickness – Product thickness specified for this stencil. BGA Reballing – Suitable for professional IC and motherboard repair applications. Compatibility Compatible Chip: MediaTek Dimensity 8100 Max (MT6895Z) Application: Lower Layer BGA Reballing Specifications Brand AMAOE Model MT6895Z Compatible Chip Dimensity 8100 Max Type BGA Reballing Stencil Application Lower Layer Thickness 0.12mm Package Includes 1 × AMAOE MT6895Z BGA Reballing Stencil..

The AMAOE Middle Layer BGA Reballing Stencil is designed for motherboard middle-layer soldering work on the Samsung Galaxy S20 Ultra G988B/BR. It helps technicians align solder paste or solder balls with the corresponding pad pattern when repairing and reassembling the separated motherboard layers. Product Specifications Brand: AMAOE Product Type: Middle Layer BGA Reballing Stencil Thickness: 0.12mm Compatible Device: Samsung Galaxy S20 Ultra Model Compatibility: G988B / G988BR Application: Motherboard middle-layer soldering and rework Package Contents: 1 × Middle Layer Stencil Usage: Match the stencil pattern with the motherboard's middle-layer solder pad layout before starting rework. Confirm the board model and pattern compatibility before use...

The AMAOE Middle Layer BGA Reballing Stencil is designed for middle-layer motherboard repair on the Samsung Galaxy S20 Ultra G988U. It helps technicians reproduce the solder-pad pattern when reworking and reassembling separated motherboard layers. Specifications Brand: AMAOE Product Type: Middle Layer BGA Reballing Stencil Compatible Device: Samsung Galaxy S20 Ultra Model: G988U Thickness: 0.12mm Application: Motherboard middle-layer soldering and rework Package Contents: 1 × Stencil Usage: Align the stencil with the matching motherboard pad pattern before reballing. Confirm the board model and stencil pattern before starting repair work...

AMAOE 1+10P 0.12mm Middle Layer BGA Reballing Stencil for OnePlus 10 Pro Model-specific middle layer BGA reballing stencil designed for OnePlus 10 Pro motherboard repair. The AMAOE 1+10P Middle Layer BGA Reballing Stencil is specifically designed for the OnePlus 10 Pro. It is used for middle-layer BGA reballing work during motherboard and IC repair. The stencil has a 0.12mm thickness and a 70 × 70mm size, making it suitable for the corresponding OnePlus 10 Pro middle-layer reballing application. Key Features OnePlus 10 Pro Compatible – Designed specifically for OnePlus 10 Pro motherboard repair. Middle Layer BGA Reballing – Suitable for middle-layer BGA reballing applications. 0.12mm Thickness – Model-specific stencil thickness. 70 × 70mm Size – Size specified for the 1+10P version. AMAOE 1+10P – Model-specific reballing stencil. Compatibility Compatible Model: OnePlus 10 Pro This 1+10P stencil is intended for the OnePlus 10 Pro. Please make sure the model matches your repair requirement before ordering. Specifications Brand AMAOE Model 1+10P Type Middle Layer BGA Reballing Stencil Compatible Model OnePlus 10 Pro Thickness 0.12mm Size 70 × 70mm Package Includes 1 × AMAOE 1+10P Middle Layer BGA Reballing Stencil..

AMAOE 1+11 0.12mm Middle Layer BGA Reballing Stencil The AMAOE 1+11 is a 0.12mm middle layer BGA reballing stencil designed for the OnePlus 11. It is used for middle-layer reballing work during motherboard and IC repair. The stencil provides the required hole pattern for solder ball placement on the middle layer, making it suitable for BGA reballing work. Brand AMAOE Model 1+11 Compatible Device OnePlus 11 Thickness 0.12mm Type Middle Layer BGA Reballing Stencil Size 70 × 70mm..

AMAOE 26×26mm 0.30mm Universal BGA Reballing Stencil The AMAOE Universal BGA Reballing Stencil measures 26×26mm and has a 0.30mm thickness with 1.27mm spacing. It is designed for universal BGA reballing applications. Brand AMAOE Size 26×26mm Thickness 0.30mm Spacing 1.27mm Type Universal BGA Reballing Stencil..

AMAOE 339S00883 0.15mm BGA Reballing Stencil The AMAOE 339S00883 is a 0.15mm BGA reballing stencil designed for the Apple M1 CPU. It is suitable for CPU reballing and chip-level motherboard repair work. Brand AMAOE Model M1 CPU Compatible CPU Apple M1 CPU 339S00883 Thickness 0.15mm Type M1 CPU BGA Reballing Stencil Package 1 × Stencil..

AMAOE 50×50mm 0.30mm Universal BGA Reballing Stencil The AMAOE Universal BGA Reballing Stencil measures 50×50mm and has a 0.30mm thickness with 1.0mm spacing. It is designed for universal BGA reballing applications. Brand AMAOE Size 50×50mm Thickness 0.30mm Spacing 1.0mm Type Universal BGA Reballing Stencil..

AMAOE A17 RAM 0.12mm Upper Layer BGA Reballing Stencil The AMAOE A17 RAM is a 0.12mm upper layer BGA reballing stencil designed for Apple A17 RAM reballing work. It is suitable for chip-level motherboard repair and RAM reballing. The stencil provides the required aperture pattern for solder ball placement on the A17 RAM upper layer during BGA reballing. Brand AMAOE Model A17 RAM Compatible IC Apple A17 RAM Thickness 0.12mm Type Upper Layer BGA Reballing Stencil Package 1 × Stencil..

AMAOE BGA316 0.15mm BGA Reballing Stencil The AMAOE BGA316 is a 0.15mm BGA reballing stencil designed for precise solder ball placement during chip-level BGA reballing and repair work. Brand AMAOE Model BGA316 Thickness 0.15mm Type BGA Reballing Stencil Package 1 × Stencil..

The AMAOE BS:1 0.12mm BGA Reballing Stencil is designed for Qualcomm SM8250 and SM8350 platforms used in Black Shark smartphones. It is suitable for BGA reballing work on compatible Black Shark 3 to 4S Pro models. Brand AMAOE Model BS:1 Compatibility Qualcomm SM8250 / SM8350 – Black Shark 3, 3 Pro, 3S, 4, 4 Pro, 4S & 4S Pro Thickness 0.12mm Type BGA Reballing Stencil Package 1 × Stencil..

The AMAOE BS:2 0.12mm BGA Reballing Stencil is designed for Qualcomm SDM845 and SM8150 platforms used in Black Shark smartphones. It is suitable for BGA reballing work on compatible Black Shark 1, 2, 2 Pro and Helo models. Brand AMAOE Model BS:2 Compatibility Qualcomm SDM845 / SM8150 – Black Shark 1, 2, 2 Pro & Helo Thickness 0.12mm Type BGA Reballing Stencil Package 1 × Stencil..

The AMAOE CD3215 4-in-1 0.12mm Magnetic BGA Reballing Stencil is designed for MacBook CD3215 IC reballing work. Its 4-in-1 design provides multiple stencil layouts in a single plate, while the magnetic construction helps with positioning during the reballing process. Brand AMAOE Model CD3215 Compatibility MacBook – CD3215 BGA IC Thickness 0.12mm Type 4-in-1 Magnetic BGA Reballing Stencil Package 1 × Stencil..

The AMAOE CD3217 4-in-1 0.12mm Magnetic BGA Reballing Stencil is designed for MacBook CD3217 IC reballing work. Its 4-in-1 design provides multiple stencil layouts in one plate, while the magnetic construction helps with positioning during the reballing process. Brand AMAOE Model CD3217 Compatibility MacBook – CD3217 BGA IC Thickness 0.12mm Type 4-in-1 Magnetic BGA Reballing Stencil Package 1 × Stencil..

The AMAOE CHG1 0.12mm Charging IC Comprehensive BGA Reballing Stencil is designed for charging IC reballing work. Its 0.12mm stencil thickness is suitable for precise solder ball placement during chip-level repair. Brand AMAOE Model CHG1 Application Charging IC BGA Reballing Thickness 0.12mm Type Comprehensive BGA Reballing Stencil Package 1 × Stencil..

AMAOE DDR BGA178 BGA Reballing Stencil The AMAOE DDR BGA178 is a BGA reballing stencil designed for DDR BGA178 IC chip soldering and reballing work. It helps position solder balls during the reballing process. Brand AMAOE Model DDR BGA178 Application DDR BGA178 IC reballing Type BGA Reballing Stencil..

AMAOE DDR BGA78 BGA Reballing Stencil The AMAOE DDR BGA78 is a BGA reballing stencil designed for DDR BGA78 IC chip reballing and soldering work. It helps position solder balls during the reballing process. Brand AMAOE Model DDR BGA78 Application DDR BGA78 IC reballing Type BGA Reballing Stencil..

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The AMAOE EMMC-2 0.15mm BGA Reballing Stencil is designed for eMMC, eMCP and UFS memory IC reballing applications. It is suitable for chip-level repair work where accurate solder ball placement is required. Brand AMAOE Model EMMC-2 Compatibility eMMC / eMCP / UFS Memory IC Thickness 0.15mm Type Memory IC BGA Reballing Stencil Package 1 × Stencil..

The AMAOE EU-2 0.12mm BGA Reballing Stencil is designed for Samsung Exynos CPU reballing applications. It supports multiple Exynos chipset models and is suitable for chip-level BGA reballing and repair work. Brand AMAOE Model EU-2 Compatibility Exynos 7880, 8895A, 8895B, 9810, 7580, 7570, 3470, 3475 & 9180 Thickness 0.12mm Material Japanese Steel Sheet Type Exynos CPU BGA Reballing Stencil..

The AMAOE EU-5 0.12mm Exynos CPU & RAM BGA Reballing Stencil is designed for reballing compatible Samsung Exynos processors and RAM ICs. It supports Exynos 1080, Exynos 2100, Exynos 9815, Exynos 9609, Exynos 1080 RAM, Exynos 2100 RAM, Samsung 3830 XGO and Exynos 8895-1703. Brand AMAOE Model EU-5 Compatible ICs Exynos 1080, Exynos 2100, Exynos 9815, Exynos 9609, Exynos 1080 RAM, Exynos 2100 RAM, Samsung 3830 XGO & Exynos 8895-1703 Thickness 0.12mm Type CPU & RAM BGA Reballing Stencil Package 1 × Stencil..

AMAOE F-IPLCD is a screen IC refinishing and reballing stencil designed for compatible iPhone display IC repair work. It is used with curing ink and the green oil network film to align the required pad pattern before UV curing. The stencil supports screen IC repair applications for iPhone 12, 12 Pro, 12 Pro Max, 13, 13 Pro, 13 Pro Max, 14, 14 Plus, 14 Pro, 14 Pro Max, 15, 15 Plus and 15 Pro Max models. Brand AMAOE Model F-IPLCD Application Screen IC Refinishing & Reballing Compatible Models iPhone 12–15 Pro Max Series Type Green Oil Network Film Reballing Stencil Package 1 × Stencil Usage: Apply curing ink to the required pad area, place the green oil network film for alignment, and cure it using a UV lamp according to the repair process...

AMAOE F936U-012 is a 0.12mm middle layer BGA reballing stencil designed for Samsung Galaxy Z Fold4 repair work. It is made from Japanese steel sheet with a precise square-hole aperture design for accurate solder ball or solder paste application during BGA reballing. Brand AMAOE Model F936U-012 Thickness 0.12mm Application Middle Layer BGA Reballing Compatibility Samsung Galaxy Z Fold4 SM-F936U-SU / W Material Japanese Steel Sheet Hole Type Square Reusable Yes The model-specific aperture pattern helps align the stencil with the required BGA area for controlled and consistent reballing work...

AMAOE G977-010 is a 0.10mm middle-layer BGA reballing stencil designed for the Samsung Galaxy S10 5G G977 series motherboard. It is used to recreate the solder points on the intermediate layer of the layered motherboard during board separation, repair and reassembly. Model: G977-010 Thickness: 0.10mm Compatible Device: Samsung Galaxy S10 5G Compatible Board Series: G977 Compatible Variants: G977U / G977R / G977T / G977P Product Type: Middle Layer BGA Reballing Stencil Application: Motherboard middle-layer solder point rework and reassembly Size: 70 × 70mm Package: 1 × Stencil This stencil is for the middle-layer motherboard soldering process and is not a CPU or individual IC reballing stencil...

AMAOE G991-012 is a 0.12mm middle layer BGA reballing stencil designed for Samsung Galaxy S21 motherboard repair and reballing work. Its model-specific aperture pattern is designed for the middle-layer reballing application. Brand AMAOE Model G991-012 Thickness 0.12mm Application Middle Layer BGA Reballing Compatibility Samsung S21 SM-G991U / 0 / W / D-S Material Japanese Steel Sheet Hole Type Square Reusable Yes Package 1 × Stencil The stencil provides a precise aperture pattern for controlled solder application during BGA reballing and is designed for repeated professional repair use...

AMAOE G996U-012 is a 0.12mm middle layer BGA reballing stencil designed for Samsung Galaxy S21+ motherboard repair. It features a square aperture pattern for the middle-layer reballing process and is made from stainless steel for repeated use. Brand AMAOE Model G996U-012 Thickness 0.12mm Application Middle Layer BGA Reballing Compatibility Samsung Galaxy S21+ — SM-G996U / SM-G996O / SM-G996D / SM-G996W Material Stainless Steel Pattern Square Reusable Yes Package 1 × Stencil The model-specific aperture pattern helps position solder accurately during middle-layer BGA reballing and motherboard repair work...