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AMAOE G991-012 is a 0.12mm middle layer BGA reballing stencil designed for Samsung Galaxy S21 motherboard repair and reballing work. Its model-specific aperture pattern is designed for the middle-layer reballing application. Brand AMAOE Model G991-012 Thickness 0.12mm Application Middle Layer BGA Reballing Compatibility Samsung S21 SM-G991U / 0 / W / D-S Material Japanese Steel Sheet Hole Type Square Reusable Yes Package 1 × Stencil The stencil provides a precise aperture pattern for controlled solder application during BGA reballing and is designed for repeated professional repair use...

AMAOE G996U-012 is a 0.12mm middle layer BGA reballing stencil designed for Samsung Galaxy S21+ motherboard repair. It features a square aperture pattern for the middle-layer reballing process and is made from stainless steel for repeated use. Brand AMAOE Model G996U-012 Thickness 0.12mm Application Middle Layer BGA Reballing Compatibility Samsung Galaxy S21+ — SM-G996U / SM-G996O / SM-G996D / SM-G996W Material Stainless Steel Pattern Square Reusable Yes Package 1 × Stencil The model-specific aperture pattern helps position solder accurately during middle-layer BGA reballing and motherboard repair work...

AMAOE G998U-012 is a 0.12mm middle layer BGA reballing stencil designed for Samsung Galaxy S21 Ultra motherboard repair and middle-layer reballing work. Its model-specific aperture pattern is used for precise solder application during the reballing process. Brand AMAOE Model G998U-012 Thickness 0.12mm Application Middle Layer BGA Reballing Compatibility Samsung Galaxy S21 Ultra — SM-G998U / SM-G998W / SM-G9980 / SM-G998D / SM-G998E Hole Type Square Reusable Yes Package 1 × Stencil The stencil is designed to align with the corresponding middle-layer BGA pattern, helping technicians apply solder accurately during Samsung Galaxy S21 Ultra motherboard repair...

The AMAOE SAM15 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard-level repair on compatible Samsung Galaxy S21 series devices. It helps mobile repair technicians align solder balls or solder paste with the matching BGA contact pattern during chip rework. Key Features Brand: AMAOE Model: SAM15 Thickness: 0.12mm Type: CPU BGA reballing stencil Compatible Series: Samsung Galaxy S21, S21+ and S21 Ultra Application: CPU reballing and smartphone motherboard repair Compatibility Note: CPU layouts can vary between regional variants and motherboard revisions. Verify the processor marking and stencil pattern before use...