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The AMAOE BS:2 0.12mm BGA Reballing Stencil is designed for Qualcomm SDM845 and SM8150 platforms used in Black Shark smartphones. It is suitable for BGA reballing work on compatible Black Shark 1, 2, 2 Pro and Helo models. Brand AMAOE Model BS:2 Compatibility Qualcomm SDM845 / SM8150 – Black Shark 1, 2, 2 Pro & Helo Thickness 0.12mm Type BGA Reballing Stencil Package 1 × Stencil..

AMAOE MI9 is a 0.12mm CPU BGA reballing stencil designed for Qualcomm Snapdragon 845 (SDM845) and Snapdragon 710 (SDM710) processor reballing. It is compatible with Xiaomi Mi 8, Mi 8 SE and Mi MIX 2S for motherboard repair and CPU BGA reballing applications. Model: MI9 Thickness: 0.12mm Compatible CPUs: Qualcomm Snapdragon 845 / Snapdragon 710 CPU Codes: SDM845 / SDM710 Compatible Devices: Xiaomi Mi 8, Mi 8 SE, Mi MIX 2S Application: CPU BGA Reballing and Motherboard Repair Package: 1 × Stencil..