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AMAOE SM6450 0.12mm CPU BGA Reballing Stencil The AMAOE SM6450 is a 0.12mm CPU BGA reballing stencil designed for the Qualcomm Snapdragon 6 Gen 1 platform. It is suitable for CPU reballing work on compatible devices such as the Honor X50. The stencil provides the required aperture pattern for SM6450 CPU reballing and solder ball placement during motherboard repair. Brand AMAOE Model SM6450 Compatible CPU Qualcomm Snapdragon 6 Gen 1 (SM6450) Compatible Device Honor X50 Thickness 0.12mm Type CPU BGA Reballing Stencil..