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AMAOE MI14 is a 0.12mm BGA reballing stencil designed for Qualcomm SM8350 / Snapdragon 888 CPU and RAM reballing. It is compatible with Xiaomi Mi 11 series and Redmi K40 Pro and includes multiple BGA patterns for CPU, RAM and supporting IC reballing. Model: MI14 Thickness: 0.12mm Main CPU: Qualcomm SM8350 / Snapdragon 888 CPU Pattern: SM8350 CPU RAM Pattern: SM8350 RAM BGA Pattern: BGA153 Supporting IC Patterns: PM8350BH-001, PM8350/C, QMP5679, SMB1396, WCD9380, WCN6851 Compatible Devices: Xiaomi Mi 11, Mi 11 Pro, Mi 11 Ultra, Mi 11i, Mi 11X Pro, Redmi K40 Pro Application: CPU, RAM and BGA IC Reballing Package: 1 × Stencil..

AMAOE SM8350 0.12mm Wafer Positioning BGA Reballing Stencil The AMAOE SM8350 is a 0.12mm wafer positioning BGA reballing stencil designed for Qualcomm Snapdragon 888 (SM8350) chip reballing work. Its dedicated aperture layout helps position solder balls accurately during BGA reballing and chip-level motherboard repair. Brand AMAOE Model SM8350 Compatible IC Qualcomm Snapdragon 888 (SM8350) Thickness 0.12mm Type Wafer Positioning BGA Reballing Stencil Package 1 × Stencil..