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MAX77849EWB Power IC is a power management integrated circuit used in Samsung Galaxy Note 4 and Samsung Galaxy S6 smartphones. ● Repair Usage This IC is commonly replaced in motherboard level repair when the device shows no power, charging failure, or unstable power behavior. ● Function Role It helps manage and distribute power between battery, charging system, and main board components to ensure stable device operation. ● Technician Note Replacement requires proper diagnosis because similar symptoms can also be caused by battery, charging port, or other board-level faults. ● Important Professional soldering skills and tools are required for installation on the motherboard...

The AMAOE EU-3 0.12mm CPU BGA Reballing Stencil is designed for Samsung Exynos processor and RAM reballing during mobile motherboard repair. It supports multiple Exynos IC layouts, making it suitable for technicians working on compatible Samsung devices. Key Features Brand: AMAOE Model: EU-3 Thickness: 0.12mm Material: Japanese steel sheet Type: CPU and RAM BGA reballing stencil Supported ICs: Exynos 7885 CPU/RAM, Exynos 9820, Exynos 9610 CPU/RAM, Exynos 990 CPU/RAM and Exynos 980 Application: IC reballing and Samsung motherboard repair The stencil helps align solder balls or solder paste with the matching BGA pad pattern during IC rework. Compatibility Note: Verify the IC model and stencil layout before use to ensure the correct pattern is selected...

The AMAOE EU-4 0.12mm Exynos IC BGA Reballing Stencil is designed for BGA reballing and motherboard repair on compatible Samsung devices using the matching Exynos IC layout. Key Features Brand: AMAOE Model: EU-4 Thickness: 0.12mm Type: Exynos IC BGA reballing stencil Compatible Brand: Samsung Application: IC reballing and mobile motherboard repair The stencil helps technicians align solder balls or solder paste with the corresponding BGA pad layout during chip rework. Compatibility Note: Confirm the IC marking and stencil pattern before use to ensure compatibility with the Samsung motherboard being repaired...

The AMAOE Middle Layer BGA Reballing Stencil is designed for motherboard middle-layer repair and solder-pad rework on compatible Samsung Galaxy Z Flip devices. Check your device model carefully before selecting this stencil. Product Details Brand: AMAOE Product Type: Middle Layer BGA Reballing Stencil Compatible Models: Samsung SM-F700F / SM-F700U Application: Motherboard middle-layer soldering and rework Important: Confirm that your phone's model number is SM-F700F or SM-F700U before ordering. This listing is for a middle-layer stencil; it is not a complete repair service or motherboard...

AMAOE Note20 0.12mm Middle Layer BGA Reballing Stencil The AMAOE Note20 is a 0.12mm middle layer BGA reballing stencil designed for Samsung Galaxy Note20 models SM-N981U, SM-N981N and SM-N9810. It is intended for motherboard IC reballing and repair work. Brand AMAOE Model SM-N981U/N/O Compatibility Samsung Galaxy Note20 SM-N981U / N981N / N9810 Thickness 0.12mm Type Middle Layer BGA Reballing Stencil Package 1 × Stencil..

The AMAOE S901U-012 Middle Layer BGA Reballing Stencil is designed for motherboard repair and middle-layer reballing work on compatible Samsung Galaxy S22 series boards. It helps technicians align solder balls with the corresponding board layout during layer rework. Key Features Designed for middle-layer BGA reballing and motherboard repair. 0.12 mm stencil thickness as specified in the supplied product title. Intended for compatible Samsung Galaxy S22 series board layouts. Suitable for professional mobile repair and chip-level rework. Compatible Models Listed Samsung Galaxy S22 — SM-S901U Samsung Galaxy S22+ — SM-S906U Additional model suffixes listed by the supplier: W, 0, D and E Product Specifications Brand: AMAOE Model: S901U-012 Thickness: 0.12 mm Type: Middle Layer BGA Reballing Stencil Application: Samsung motherboard middle-layer repair Important Note: Confirm the complete Samsung model number and stencil layout before use. The supplied title groups multiple model suffixes together; verify exact compatibility with the supplier before listing all of them...

The AMAOE S908U-012 Middle Layer BGA Reballing Stencil is designed for Samsung Galaxy S22 Ultra motherboard repair. It helps technicians align solder balls during middle-layer reballing and board rework on compatible motherboard layouts. Key Features Designed for motherboard middle-layer BGA reballing. 0.12 mm stencil thickness as specified in the supplied product title. Intended for compatible Samsung Galaxy S22 Ultra board layouts. Suitable for professional mobile motherboard repair and rework. Compatible Models Samsung Galaxy S22 Ultra — SM-S908U Additional model suffixes listed by the supplier: W, 0, D and E Product Specifications Brand: AMAOE Model: S908U-012 Thickness: 0.12 mm Type: Middle Layer BGA Reballing Stencil Application: Samsung Galaxy S22 Ultra motherboard repair Usage Note: Verify the complete device model and stencil aperture layout before use to ensure compatibility with the motherboard being repaired...

The AMAOE S916U-012 Middle Layer BGA Reballing Stencil is designed for motherboard middle-layer repair on compatible Samsung Galaxy S23+ devices. It helps technicians align solder balls with the board's middle-layer layout during reballing and motherboard rework. Key Features Designed for middle-layer BGA reballing and motherboard repair. Made for compatible Samsung Galaxy S23+ board layouts. Helps with solder-ball alignment during middle-layer rework. Suitable for mobile repair technicians and electronics workshops. Compatible Models and Layout Device: Samsung Galaxy S23+ Model: SM-S916U Additional model listed: SM-S916W Board revision/layout: REV07E W44 Product Specifications Brand: AMAOE Model: S916U-012 Type: Middle Layer BGA Reballing Stencil Application: Samsung Galaxy S23+ motherboard repair Usage Note: Match the stencil layout and motherboard revision before use. Confirm compatibility with the supplier if the board revision differs...

The AMAOE SAM1 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible Samsung Galaxy devices using the Qualcomm MSM8998 processor layout specified for this stencil. Key Features Brand: AMAOE Model: SAM1 Thickness: 0.12mm Processor: Qualcomm MSM8998 Type: Multi-function CPU BGA reballing stencil Listed Compatible Models: Samsung Galaxy S8, S8 Plus and Note8 Application: CPU reballing and mobile motherboard repair The stencil helps technicians align solder balls or solder paste with the matching BGA layout during CPU rework. Compatibility Note: Verify the processor marking and BGA pattern on the motherboard before use, as device variants may differ...

The AMAOE SAM10 0.12mm CPU BGA Reballing Stencil is designed for professional mobile motherboard repair and CPU reballing. It supports compatible processors based on the Samsung Exynos 9820 and Qualcomm Snapdragon 855 (SM8150) platforms. Its multi-function BGA stencil layout helps technicians apply solder paste or position solder balls on compatible CPU contact patterns during reballing and chip repair. Product Specifications Brand: AMAOE Model: SAM10 Thickness: 0.12mm Type: Multi-function CPU BGA reballing stencil Supported platforms: Exynos 9820 and SM8150 Application: CPU reballing and mobile motherboard repair Compatible Devices Samsung Galaxy S10 Samsung Galaxy S10+ Samsung Galaxy S10 5G Samsung Galaxy Note10 Listed model references: G9730, G975, G977 and N975. Compatibility Note: Confirm the processor marking and BGA layout before use, as compatibility may vary by device variant and motherboard revision...

The AMAOE SAM11 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and mobile motherboard repair on compatible Samsung devices. It supports the listed Qualcomm Snapdragon 710 (SDM710) and Samsung Exynos 7904 processor platforms. The multi-function BGA stencil helps technicians position solder paste or solder balls on the compatible CPU contact layout during chip rework. Its 0.12mm thickness is intended for the specified stencil pattern. Product Specifications Brand: AMAOE Model: SAM-11 Thickness: 0.12mm Type: Multi-function CPU BGA reballing stencil Supported processor platforms: Qualcomm SDM710 and Samsung Exynos 7904 Application: CPU reballing and mobile motherboard repair Listed Compatible Devices and Model References Samsung Galaxy J7 — J720 Samsung Galaxy A30 — A305 Samsung Galaxy A8s — G8870 / G887 Samsung Galaxy A40s Compatibility Note: Confirm the processor marking and BGA layout before use. Phone model codes and processor platforms can vary by region, so verify compatibility with the actual motherboard...

AMAOE SAM12 0.12mm CPU BGA Reballing Stencil The AMAOE SAM12 is a multi-function BGA reballing stencil designed for professional mobile motherboard repair. It is listed for compatible Qualcomm Snapdragon 865 (SM8250) and Samsung Exynos 990 CPU layouts used in the Samsung Galaxy S20 series. Product Specifications Brand AMAOE Model SAM12 Thickness 0.12mm Stencil Type Multi-Function CPU BGA Reballing Stencil CPU Platforms Qualcomm Snapdragon 865 (SM8250) and Samsung Exynos 990 Application CPU reballing and mobile motherboard repair Compatible Samsung Galaxy Devices Samsung Galaxy S20 Samsung Galaxy S20+ Samsung Galaxy S20 Ultra Note: Compatibility depends on the installed processor and motherboard version. Check the CPU marking and stencil pattern before reballing. Key Features Designed for compatible CPU BGA reballing work. 0.12mm stencil thickness. Multi-function layout for supported chip patterns. Suitable for professional smartphone motherboard repair and chip rework. Package Contents: 1 × AMAOE SAM12 0.12mm BGA Reballing Stencil...

AMAOE SAM13 CPU BGA Reballing Stencil The AMAOE SAM13 CPU BGA Reballing Stencil is designed for mobile phone motherboard repair and CPU reballing work. The listed stencil layouts cover selected Qualcomm Snapdragon and MediaTek processor platforms used in compatible Samsung Galaxy A-series devices. Product Specifications Brand AMAOE Model SAM13 Stencil Type CPU BGA Reballing Stencil Net Listed Processor Platforms SDM450, Snapdragon 660, SM6150 and MT6762 Application CPU reballing and mobile motherboard repair Listed Compatible Devices Samsung Galaxy A10s Samsung Galaxy A60 — SM-A606 series reference Samsung Galaxy A70 — SM-A705F reference Samsung Galaxy A80 — SM-A805 series Samsung Galaxy A9 (2018) — SM-A920F reference Additional model reference: A605F Key Features Designed for compatible CPU BGA reballing tasks. Supports the processor layouts listed for this stencil model. Useful for smartphone motherboard repair and chip-level servicing. Helps align solder balls or solder paste with the matching BGA pattern. Compatibility Note: Processor layouts may vary by phone model and regional version. Confirm the actual CPU marking and stencil pattern before reballing...

The AMAOE SAM14 CPU BGA Reballing Stencil is designed for CPU reballing and motherboard-level repair on compatible Samsung Galaxy A-series smartphones. It supports listed Samsung Exynos processor platforms, making it useful for technicians performing chip-level repair and rework. Key Features Brand: AMAOE Model: SAM14 Type: CPU BGA reballing stencil Supported Processors: Exynos 7870, 7884, 7885, 7904, 9610 and 9611 Compatible Series: Selected Samsung Galaxy A-series models from A10 to A70 Application: CPU reballing and mobile motherboard repair The stencil helps align solder balls or solder paste with the matching CPU BGA layout during reballing. Always check the processor marking and stencil pattern before starting the repair. Compatibility Note: Support may vary by device variant and motherboard revision. Confirm the exact CPU layout before use...

The AMAOE SAM15 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard-level repair on compatible Samsung Galaxy S21 series devices. It helps mobile repair technicians align solder balls or solder paste with the matching BGA contact pattern during chip rework. Key Features Brand: AMAOE Model: SAM15 Thickness: 0.12mm Type: CPU BGA reballing stencil Compatible Series: Samsung Galaxy S21, S21+ and S21 Ultra Application: CPU reballing and smartphone motherboard repair Compatibility Note: CPU layouts can vary between regional variants and motherboard revisions. Verify the processor marking and stencil pattern before use...

The AMAOE SAM17 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and chip-level motherboard repair on compatible Samsung Galaxy S22 series devices. It is listed for the Qualcomm Snapdragon 8 Gen 1 (SM8450) and Samsung Exynos 2200 (S5E9925) processor platforms. Key Features Brand: AMAOE Model: SAM17 Thickness: 0.12mm Type: CPU BGA reballing stencil Supported Platforms: Snapdragon 8 Gen 1 (SM8450) and Exynos 2200 (S5E9925) Compatible Series: Samsung Galaxy S22 series, subject to processor variant Application: CPU reballing and mobile motherboard repair The stencil helps technicians align solder balls or solder paste with the matching CPU BGA layout during chip rework. Compatibility Note: Snapdragon and Exynos versions may use different motherboard layouts. Confirm the installed processor and stencil pattern before use...

The AMAOE SAM18 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard-level repair on compatible Samsung Galaxy devices. It is listed for the Samsung Exynos 1330 (E8535P) and Exynos 1380 (E8835P) processor platforms. Key Features Brand: AMAOE Model: SAM18 Thickness: 0.12mm Type: CPU BGA reballing stencil Supported Processors: Exynos 1330 (E8535P) and Exynos 1380 (E8835P) Compatible Devices: Samsung Galaxy A14 and Galaxy A54, subject to processor variant Application: CPU reballing and smartphone motherboard repair The stencil helps technicians align solder balls or solder paste with the matching BGA contact pattern during CPU rework. Compatibility Note: Check the installed processor and BGA layout before use. Compatibility may vary by regional model and motherboard revision...

The AMAOE SAM19 CPU BGA Reballing Stencil is designed for CPU reballing and chip-level motherboard repair on compatible Samsung Galaxy devices. It is listed for Qualcomm Snapdragon processor platforms, including the Snapdragon 8 Gen 2 (SM8550) and Snapdragon 8 Gen 3 (SM8650). Key Features Brand: AMAOE Model: SAM19 Type: CPU BGA reballing stencil Supported Processors: Snapdragon 8 Gen 2 (SM8550) and Snapdragon 8 Gen 3 (SM8650) Listed Compatible Devices: Samsung Galaxy S23, S23 Ultra, S24 and S24 Ultra Application: CPU reballing and smartphone motherboard repair The stencil helps technicians align solder balls or solder paste with the corresponding CPU BGA pattern during chip rework. Compatibility Note: Processor and motherboard layouts can differ between device variants. Confirm the installed chipset and stencil pattern before use...

The AMAOE SAM20 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard-level repair on compatible Samsung Galaxy devices. It is listed for the MediaTek MT6835V processor platform. Key Features Brand: AMAOE Model: SAM20 Thickness: 0.12mm Type: CPU BGA reballing stencil Supported Processor: MediaTek MT6835V Listed Model References: SM-A156U and SM-A156E Application: CPU reballing and smartphone motherboard repair The stencil helps technicians align solder balls or solder paste with the matching BGA contact pattern during CPU rework. Compatibility Note: Verify the processor marking and BGA layout on the actual motherboard before use, as regional variants may differ...

The AMAOE SAM21 CPU BGA Reballing Stencil is designed for CPU reballing and chip-level motherboard repair on compatible Samsung Galaxy S25 series devices. It is listed for the Qualcomm Snapdragon 8 Elite (SM8750) processor platform. Key Features Brand: AMAOE Model: SAM21 Type: CPU BGA reballing stencil Supported Processor: Qualcomm Snapdragon 8 Elite (SM8750) Compatible Devices: Samsung Galaxy S25 and Galaxy S25+ Application: CPU reballing and smartphone motherboard repair The stencil helps technicians align solder balls or solder paste with the matching CPU BGA contact pattern during chip rework. Compatibility Note: Confirm the installed processor and BGA layout before use. Compatibility may vary by device variant and motherboard revision...

The AMAOE SAM22 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and chip-level motherboard repair on compatible Samsung Galaxy A17 devices. It is listed for selected processor layouts, including MT6789V, SM6475 and MT6769V. Key Features Brand: AMAOE Model: SAM22 Thickness: 0.12mm Type: CPU BGA reballing stencil Listed Processor Codes: MT6789V, SM6475 and MT6769V Compatible Device: Samsung Galaxy A17, subject to processor and board layout Application: CPU reballing and mobile motherboard repair The stencil helps technicians align solder balls or solder paste with the matching BGA contact pattern during chip rework. Compatibility Note: Processor codes can correspond to different device platforms. Confirm the actual chipset marking and stencil layout against the motherboard before use...

The AMAOE SAM3 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible Samsung Galaxy devices using the Exynos 7420 processor platform. Its multi-function stencil layout supports chip-level servicing where the matching BGA pattern is required. Key Features Brand: AMAOE Model: SAM3 Thickness: 0.12mm Material: Tin steel, as stated in the supplied product title Type: Multi-function CPU BGA reballing stencil Supported Processor: Samsung Exynos 7420 Listed Compatible Devices: Samsung Galaxy S6, S6 Plus and Galaxy Note5 Application: CPU reballing and mobile motherboard repair The stencil helps technicians align solder balls or solder paste with the corresponding BGA contact layout during CPU rework. Compatibility Note: Verify the processor marking and stencil pattern against the actual motherboard before use. Device variants may use different hardware configurations...

The AMAOE SAM4 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible Samsung Galaxy devices using supported Exynos processor layouts. It is a multi-function stencil for chip-level repair work where the matching BGA pattern is required. Key Features Brand: AMAOE Model: SAM4 Thickness: 0.12mm Type: Multi-function CPU BGA reballing stencil Supported Processors: Exynos 3470, Exynos 7580 and Exynos 7880, as listed by the supplier Listed Compatible Models: Samsung Galaxy A7, A5, A3, S5 and J7 Application: CPU reballing and mobile motherboard repair The stencil helps technicians position solder balls or solder paste according to the matching BGA layout during CPU rework. Compatibility Note: Check the processor marking and BGA layout before use. Samsung devices may have different processor variants, so confirm that the stencil pattern matches the motherboard being repaired...

The AMAOE SAM9 0.12mm BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible Samsung Galaxy J-series devices. It supports the processor families listed by the supplier for chip-level repair work. Key Features Brand: AMAOE Model: SAM9 Thickness: 0.12mm Type: CPU BGA reballing stencil Listed Processor Support: Exynos 7570, Exynos 3475, SC9830A and 7730S Listed Compatible Series: Samsung Galaxy J1, J2, J3 and J4 Application: CPU reballing and mobile motherboard repair The stencil helps technicians align solder balls or solder paste with the matching BGA layout during chip rework. Compatibility Note: Processor and motherboard configurations can vary by model and region. Verify the processor marking and BGA pattern before using the stencil...

The AMAOE Samsung Galaxy Note10 Middle Layer BGA Stencil is designed for motherboard repair and BGA rework on compatible Samsung Galaxy Note10 models. It is intended for use when the middle-layer BGA layout matches the stencil pattern. Key Features Brand: AMAOE Product Type: Middle Layer BGA Stencil Compatible Model Numbers: SM-N970U and N9700 Device Series: Samsung Galaxy Note10 Application: BGA rework and mobile motherboard repair The stencil helps technicians align solder balls or solder paste with the corresponding BGA pad layout during motherboard-level repair. Compatibility Note: Confirm the motherboard model and BGA pattern before use to ensure the stencil matches the device...

AMAOE Middle Layer BGA Reballing Stencil is designed for motherboard middle-layer repair and solder-pad rework on compatible Samsung Galaxy S20 series devices. Choose the Correct Stencil Stencil 1 SM-G986B / SM-G985F / SM-G986B Stencil 2 SM-G986B / SM-G985F / SM-G986N Important: Select the required stencil from the “Stencil Type” dropdown before adding the product to your cart. Only the selected stencil will be ordered unless the product option explicitly states otherwise. Match the codes with your motherboard before purchasing. Product Details Brand: AMAOE Product Type: Middle Layer BGA Reballing Stencil Application: Motherboard middle-layer repair and soldering rework Selection: Choose Stencil 1 or Stencil 2..

. Original Power Management IC MAX77833 Power IC is designed for Samsung Galaxy S6 motherboard repair and power management circuit replacement. . Advanced PMIC Solution Supports power regulation, charging management, voltage control, and stable device operation during repair and maintenance procedures. . Fix Common Power Issues Ideal for repairing charging faults, power failures, boot issues, battery-related problems, and motherboard power circuit damage. . Precision Repair Component Manufactured for accurate compatibility with Samsung Galaxy S6 boards, helping technicians perform reliable micro-soldering repairs. . Professional Repair Use Suitable for mobile repair technicians, motherboard specialists, and advanced electronic repair environments. . Quality Checked Component Each IC is carefully inspected before dispatch to help ensure dependable repair performance and installation reliability. . Trusted by Technicians Available at UToolsZone, trusted by mobile repair professionals for premium IC chips, repair tools, and motherboard repair solutions...

■ S2DPS01 Charger / Power IC S2DPS01 IC is a professional-grade charger and power management IC designed for Samsung S20 Ultra motherboard repair and charging circuit replacement. ■ Charging & Power Control Helps regulate charging function, power distribution, and stable voltage flow inside the device for smooth operation. ■ Fix Common Issues Ideal for repairing charging failure, dead phone condition, boot issues, restart problems, and motherboard power faults. ■ Precision Repair Component Designed for chip-level repair and accurate replacement on Samsung S20 Ultra boards, suitable for professional micro-soldering work. ■ Stable Performance Manufactured using high-quality materials to ensure reliable performance and long-lasting durability. ■ Quality Checked IC Each IC is tested and inspected before dispatch to ensure proper working condition. ■ Trusted by Technicians Available at UToolsZone, trusted by mobile repair professionals for IC chips, motherboard repair components, and advanced repair tools...

◆ S620 Power IC (Mobile Board Level Component) S620 power IC is used in mobile motherboard circuits for power regulation and stable voltage distribution in Samsung devices. ● Repair Usage This IC is commonly replaced when the phone has no power, sudden shutdown issues, or motherboard power failure problems. ● Function in Device It helps manage internal power flow between battery, CPU, and other board components for stable operation. ▶ Installation Use Used by professional mobile repair technicians during motherboard level IC replacement and repair work. ★ Important Note Proper testing and professional soldering equipment are required for installation on mobile PCBs...