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The AMAOE EMMC-2 0.15mm BGA Reballing Stencil is designed for eMMC, eMCP and UFS memory IC reballing applications. It is suitable for chip-level repair work where accurate solder ball placement is required. Brand AMAOE Model EMMC-2 Compatibility eMMC / eMCP / UFS Memory IC Thickness 0.15mm Type Memory IC BGA Reballing Stencil Package 1 × Stencil..

The AMAOE EMMC-3 0.15mm Multi-IC BGA Reballing Stencil is designed for reballing a wide range of memory IC packages used in mobile and electronic repair. It supports eMMC, eMCP, UFS, uMCP, LPDDR, NAND and PCIe memory IC applications with multiple BGA layouts. Brand AMAOE Model EMMC-3 Application eMMC / eMCP / UFS / uMCP / LPDDR / NAND / PCIe Memory IC Reballing Supported BGA BGA60, BGA70, BGA110, BGA153, BGA162, BGA169, BGA178, BGA186, BGA200, BGA221, BGA254, BGA297 & BGA315 Thickness 0.15mm Type Multi-IC BGA Reballing Stencil Package 1 × Stencil..