2UUL BH04 Micro Jig IC Mini Glass Fixture for Mobile Phone Motherboard Repair

2UUL BH04 Micro Jig IC Mini Glass Fixture for Mobile Phone Motherboard Repair

Key Features and Specifications

Material: Built with a tempered insulated glass work surface that offers excellent heat resistance up to 500°C. The surface is easy to clean and resistant to welding oil and rosin residue.

Secure Clamping: Features a rotary locking mechanism and a force-bearing IC beam clamp that firmly holds motherboards and chips without movement or rebound, helping prevent damage during repair operations.

Adjustable Design: Supports high, middle, and low positions. The fixture can be adjusted by loosening the bottom screws to accommodate PCBs and chips of different sizes and thicknesses.

Heat Dissipation: Designed with a bottom heat sink structure and anti-slip pads, allowing hot air to dissipate efficiently while protecting components during soldering and rework.

Multi-Function Applications:

• Mobile phone motherboard repair
• CPU and NAND chip fixing for cleaning and tin removal
• IC soldering and micro-soldering work
• BGA rework and chip maintenance
• Protection of double-layer motherboards during separation and reassembly

Package Includes

1 × 2UUL BH04 Micro Jig IC Mini Glass Fixture