2UUL Red Skull Solder Paste for Repair (138℃ 148℃ 183℃ 199℃) 50g

2UUL 50g 138*/ 148* / 183*C / 199* Red Skull Solder Tin Paste for Repair

Key features

• Melting Points: The Red Skull series is available in several melting points to suit different repair needs and component sensitivities:

  • 138°C (low temp, for heat-sensitive components)

  • 148°C (low temp)

  • 183°C (moderate/eutectic point)

  • 199°C (higher temp, for general soldering)

• Applications: Ideal for BGA (Ball Grid Array) stencil reballing, SMD (Surface Mount Device) rework, and general motherboard repair. It is particularly suited for modern smartphones where low-temperature soldering is critical to prevent board warping.

• Performance:

  • Strong conductivity and anti-oxidation properties ensure reliable, long-lasting connections.

  • Minimal residue after soldering, reducing the need for extensive post-solder cleaning ("no-clean formula").

  • Good wetting action for consistent, clean solder joints.

  • Not easy to crack and no false welding issues.

• Packaging: Typically comes in a 50g container (tub or syringe-like) for controlled dispensing. 

How to Use

1. Clean: Clean the PCB area to be worked on to ensure it is free of old solder, dust, or oil.

2. Apply: Apply a small, even amount of the solder paste onto the pads, often using a stencil for BGA work.

3. Heat: Heat the area using a hot air rework station or reflow oven until the paste melts at its specified temperature.

4. Cool: Allow the joint to cool naturally to form a solid connection.

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